Electrochemical sensor

• US 8,864,968 B2
• Filed: 08/17/2010
• Issued: 10/21/2014
• Est. Priority Date: 08/17/2009
• Status: Active Grant

• Current Assignee: NXP B.V. (NXP Semiconductors NV)
• Original Assignee: NXP B.V. (NXP Semiconductors NV)
• Inventors: Merz, Matthias, Ponomarev, Youri Victorovitch
• Primary Examiner(s): DIETERLE, JENNIFER M
• Application Number:
  US12/858,353
• Publication Number:
  US 20110036913A1
• Time in Patent Office: 1,526 Days
• Field of Search: 257/253, 204/435, 204/414, 204/416, 204/433
• US Class Current: 204/433
• CPC Class Codes: G01N 27/333 Ion-selective electrodes or membranes glass electrodes G01N27/36
• CPC Class Codes: G01N 27/414 Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
• CPC Class Codes: G01N 27/4167 pH electrodes therefor G01N27/302, G01N27/36
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

An electrochemical sensor device including a sensor chip having an integrated electrochemical sensor element; and a substrate having a first surface on which the sensor chip is mounted, the substrate comprising a reference electrode structure for the integrated electrochemical sensor element, the reference electrode structure connected to the sensor chip via an electrical connection on the first surface of the substrate.

Claims

1. An electrochemical sensor device comprising:

a sensor chip having an integrated electrochemical sensor element; and

a substrate having a first surface on which the sensor chip is mounted and a second surface;

a reference electrode structure including a reference electrode and a gel-based electrolyte adjacent thereto, the reference electrode structure configured and arranged with the integrated electrochemical sensor element for sensing pH, the reference electrode structure connected to the sensor chip via an electrical connection on the first surface of the substrate;

a liquid access opening through the substrate from the first surface of the substrate to the second surface of the substrate and configured and arranged to expose the integrated electrochemical sensor element; and

a diffusion barrier layer covering the gel-based electrolyte and configured and arranged to mitigate out-diffusion of electrolytes from the gel-based electrolyte.

2. The sensor device of claim 1 wherein the electrochemical sensor element is a pH sensor element.

3. The sensor device of claim 1 wherein the reference electrode structure extends through the substrate between the first surface and a second opposing surface of the substrate.

4. The sensor device of claim 1 wherein the gel-based electrolyte adjacent the reference electrode is exposed to an environment extending over a second opposing surface of the substrate, wherein the integrated electrochemical sensor element is exposed to the environment extending over a second surface of the substrate.

5. The sensor device of claim 1 wherein the gel-based electrolyte includes a conductive gel selected from agar and poly-(2-hydroxyethyl methacrylate).

6. The sensor device of claim 1 wherein the reference electrode is in the form of a Ag/AgCl layer.

7. The sensor device of claim 1 wherein the gel-based electrolyte includes a conductive gel or solid state electrolytes, and wherein the diffusion barrier layer is further configured and arranged to increase a lifetime of the reference electrode structure.

8. The sensor device of claim 3 wherein the electrochemical sensor element is disposed over a hole in the substrate for exposing the electrochemical sensor element to an environment extending over the second surface of the substrate.

9. An RFID tag comprising the sensor device of claim 1, the RFID tag comprising an antenna element electrically connected to an RFID element of the sensor chip via further electrical connections on the first surface of the substrate.

10. A method of manufacturing an electrochemical sensor device, the method comprising:

providing a substrate having a first surface and a second opposing surface;

applying electrical connections to the first surface of the substrate;

forming a reference electrode structure in the substrate;

connecting a sensor chip having an integrated electrochemical sensor element to the first surface, electrically connecting the sensor element to the reference electrode structure via the electrical connection;

providing a liquid access opening through the substrate and from the first surface of the substrate to the second surface of the substrate and configured and arranged to expose the integrated electrochemical sensor element;

applying a reference electrode layer over the electrical connection;

applying a gel-based electrolyte layer over the reference electrode layer; and

covering the gel-based electrolyte layer with a diffusion barrier layer.

11. The method of claim 10 wherein a hole is provided in the substrate within which the reference electrode structure is formed, such that the reference electrode structure extends through the substrate between the first and second surfaces of the substrate.

12. The method of claim 10 wherein

applying the gel-based electrolyte layer includes depositing an ion reservoir.

13. The method of claim 12 wherein covering the gel-based electrolyte layer with the diffusion barrier layer includes depositing PVC, nafion, a cellulose material, or a combination thereof.

14. The method of claim 10 wherein the sensor chip is connected such that the integrated electrochemical sensor element in the chip is disposed over a hole in the substrate for exposing the electrochemical sensor to an environment extending over the second surface of the substrate.

15. The method of claim 10 further comprising forming an RFID tag comprising the sensor device by electrically connecting an antenna element to an RFID element of the sensor chip via further electrical connections applied on the first surface of the substrate.