Formed article, method for producing same, electronic device member, and electronic device
First Claim
1. An electronic device member comprising a formed article;
- wherein the formed article comprises an ion-implanted layer obtained by implanting ions of a silicon compound into a polymer layer;
wherein the polymer layer is a polyorganosiloxane compound-containing layer;
wherein the ion-implanted layer is obtained by implanting ions of the silicon compound into the polymer layer by plasma ion implantation method; and
wherein the formed article has a water vapor transmission rate at a temperature of 40°
C. and a relative humidity of 90% of less than 1g/m2/day.
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Abstract
Disclosed is a formed article comprising an ion-implanted layer obtained by implanting ions of a silicon compound into a polymer layer. Also disclosed are: a method of producing the formed article, the method comprising implanting ions of a silicon compound into a surface of a polymer layer of a formed body that includes the polymer layer in its surface; an electronic device member comprising the formed article; an electronic device comprising the electronic device member. Consequently, the present invention provides: a formed article which has excellent gas barrier capability, bendability and surface flatness; a method of producing the formed article, an electronic device member comprising the formed article; an electronic device comprising the electronic device member.
40 Citations
2 Claims
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1. An electronic device member comprising a formed article;
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wherein the formed article comprises an ion-implanted layer obtained by implanting ions of a silicon compound into a polymer layer; wherein the polymer layer is a polyorganosiloxane compound-containing layer; wherein the ion-implanted layer is obtained by implanting ions of the silicon compound into the polymer layer by plasma ion implantation method; and wherein the formed article has a water vapor transmission rate at a temperature of 40°
C. and a relative humidity of 90% of less than 1g/m2/day. - View Dependent Claims (2)
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Specification
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- Resources
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Current AssigneeLintec Corporation
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Original AssigneeLintec Corporation
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InventorsKondo, Takeshi, Uemura, Kazue, Suzuki, Yuta, Hoshi, Shinichi
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Primary Examiner(s)Peng, Kuo-Liang
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Application NumberUS13/256,143Publication NumberTime in Patent Office1,672 DaysField of Search524/261, 250/492.3US Class Current524/261CPC Class CodesC08G 77/04 PolysiloxanesC08J 2383/04 PolysiloxanesC08J 7/048 Forming gas barrier coatingsC08J 7/06 with compositions not conta...C23C 14/20 on organic substratesC23C 14/48 Ion implantationC23C 14/562 for coating elongated subst...
