Solid state lighting device

• US 8,866,166 B2
• Filed: 07/29/2013
• Issued: 10/21/2014
• Est. Priority Date: 06/05/2009
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Hussell, Christopher P.
• Primary Examiner(s): POTTER, ROY KARL
• Application Number:
  US13/953,438
• Publication Number:
  US 20140027801A1
• Time in Patent Office: 449 Days
• Field of Search: 257/91, 257/99, 257/100, 257/712, 362/296
• US Class Current: 257/91
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12032 Schottky diode
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A light emission package includes at least one solid state emitter, a leadframe, and a body structure encasing a portion of the leadframe. At least one aperture is defined in an electrical lead to define multiple electrical lead segments, with at least a portion of the aperture disposed outside an exterior side wall of the package. A recess may be defined in the exterior side wall to receive a bent portion of an electrical lead. A body structure cavity may be bounded by a floor, and side wall portions and end wall portions that are separated by transition wall portions including a curved or segmented upper edge, with different wall portions being disposed at different angles of inclination.

Claims

1. A light emission package comprising:

at least one solid state emitter;

a heatsink element in thermal communication with the at least one solid state emitter;

a leadframe defining a plurality of electrical leads in electrical communication with the at least one solid state emitter; and

a body structure encasing at least a portion of the leadframe and arranged to retain the heatsink element, wherein the body structure defines a cavity, and the at least one solid state emitter is disposed within the cavity;

wherein the cavity is bounded by a floor, side wall portions, end wall portions, and transition wall portions;

wherein a transition wall portion is disposed between each respective side wall portion and end wall portion; and

wherein each side wall portion and each end wall portion includes a substantially straight upper edge, and each transition wall portion includes a curved or segmented upper edge transitioning from the upper edge of a side wall portion to the upper edge of an end wall portion.

2. The light emission package of claim 1, wherein each transition wall portion is inclined at a larger average angle, relative to a plane perpendicular to the floor, than each side wall portion and each end wall portion.

3. The light emission package of claim 1, wherein each side wall portion and each end wall portion is inclined at an angle of at least about 40 degrees relative to a plane perpendicular to the floor.

4. The light emission package of claim 1, wherein each transition wall portion comprises at least a section thereof that is inclined at an angle of at least about 50 degrees relative to a plane perpendicular to the floor.

5. The light emission package of claim 1, wherein the body structure has a length and a width that are substantially equal.

6. The light emission package of claim 1, wherein the at least one solid state emitter comprises a plurality of solid state emitters.