Solid state lighting device
First Claim
1. A light emission package comprising:
- at least one solid state emitter;
a heatsink element in thermal communication with the at least one solid state emitter;
a leadframe defining a plurality of electrical leads in electrical communication with the at least one solid state emitter; and
a body structure encasing at least a portion of the leadframe and arranged to retain the heatsink element, wherein the body structure defines a cavity, and the at least one solid state emitter is disposed within the cavity;
wherein the cavity is bounded by a floor, side wall portions, end wall portions, and transition wall portions;
wherein a transition wall portion is disposed between each respective side wall portion and end wall portion; and
wherein each side wall portion and each end wall portion includes a substantially straight upper edge, and each transition wall portion includes a curved or segmented upper edge transitioning from the upper edge of a side wall portion to the upper edge of an end wall portion.
3 Assignments
0 Petitions
Accused Products
Abstract
A light emission package includes at least one solid state emitter, a leadframe, and a body structure encasing a portion of the leadframe. At least one aperture is defined in an electrical lead to define multiple electrical lead segments, with at least a portion of the aperture disposed outside an exterior side wall of the package. A recess may be defined in the exterior side wall to receive a bent portion of an electrical lead. A body structure cavity may be bounded by a floor, and side wall portions and end wall portions that are separated by transition wall portions including a curved or segmented upper edge, with different wall portions being disposed at different angles of inclination.
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Citations
6 Claims
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1. A light emission package comprising:
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at least one solid state emitter; a heatsink element in thermal communication with the at least one solid state emitter; a leadframe defining a plurality of electrical leads in electrical communication with the at least one solid state emitter; and a body structure encasing at least a portion of the leadframe and arranged to retain the heatsink element, wherein the body structure defines a cavity, and the at least one solid state emitter is disposed within the cavity; wherein the cavity is bounded by a floor, side wall portions, end wall portions, and transition wall portions; wherein a transition wall portion is disposed between each respective side wall portion and end wall portion; and wherein each side wall portion and each end wall portion includes a substantially straight upper edge, and each transition wall portion includes a curved or segmented upper edge transitioning from the upper edge of a side wall portion to the upper edge of an end wall portion. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification