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LED package with increased feature sizes

  • US 8,866,169 B2
  • Filed: 04/09/2010
  • Issued: 10/21/2014
  • Est. Priority Date: 10/31/2007
  • Status: Active Grant
First Claim
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1. A light emitter package, comprising:

  • a submount;

    a light emitter chip mounted on said submount;

    a lens over said light emitter chip, the ratio of the width of said light emitter chip to the width of said lens in a given direction being 0.5 or greater;

    wherein the ratio of the width of said light emitter chip to the width of said submount in a given direction is 0.35 or more.

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