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Methods for embedding controlled-cavity MEMS package in integration board

  • US 8,866,237 B2
  • Filed: 02/27/2012
  • Issued: 10/21/2014
  • Est. Priority Date: 02/27/2012
  • Status: Active Grant
First Claim
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1. An embedded micro-electro-mechanical system (MEMS) comprising:

  • a semiconductor chip embedded in an insulating board, the chip having a cavity including a radiation sensor MEMS, the opening of the cavity at the chip surface covered by a plate transmissive to the radiation sensed by the MEMS;

    the plate surface remote from the cavity having a bare central area, to be exposed to the radiation sensed by the MEMS in the cavity, and a peripheral area covered by a metal film touching the plate surface and a layer of adhesive stacked on the metal film.

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