Touch-controlled electronic apparatus and related assembly method

• US 8,866,755 B2
• Filed: 08/25/2010
• Issued: 10/21/2014
• Est. Priority Date: 05/03/2010
• Status: Active Grant

• Current Assignee: HTC Corporation
• Original Assignee: HTC Corporation
• Inventors: Lee, Hsin-Hao, Chia, Chia-Jun
• Primary Examiner(s): Chang, Kent
• Assistant Examiner(s): Lu, William
• Application Number:
  US12/862,796
• Publication Number:
  US 20110267284A1
• Time in Patent Office: 1,518 Days
• Field of Search: 345156-184
• US Class Current: 345/173
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/04164 Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
• CPC Class Codes: G06F 3/044 by capacitive means

Abstract

A touch-controlled electronic apparatus includes a loading plate, a touch panel, a flexible PCB, a sensor pad, and a control circuit. The loading plate has a display touch area, a wire area, and a hot bonding area. The touch panel is disposed on the display touch area of the loading plate. The flexible PCB has a touch button area and a control circuit area. The sensor pad is disposed on the touch button area of the flexible PCB and is used as touch buttons. The control circuit is disposed on the control circuit area of the flexible PCB. The flexible PCB is disposed and bonded to the loading plate, wherein the touch button area is disposed on at least one of the wire area and the hot bonding area.

Claims

1. A touch-controlled electronic apparatus, comprising:

a loading plate, having a display touch area, a wire area, and a first hot bonding area;

a touch panel, disposed on the display touch area of the loading plate, for receiving a first touch to generate a first touch signal;

a flexible printed circuit board (PCB), having at least a touch button area and a control circuit area;

a sensor pad, disposed on the touch button area of the flexible PCB, and used as a touch button for detecting a second touch to generate a second touch signal; and

a control circuit, disposed on the control circuit area of the flexible PCB and electronically connected to the touch panel and the sensor pad, for reading the first touch signal as well as the second touch signal to respectively generate a first control signal as well as a second control signal, and for determining a first position of the first touch and a second position of the second touch according to the first control signal and the second control signal, respectively;

wherein the flexible PCB is disposed and bonded to the loading plate, and the touch button area is disposed on at least one of the wire area and the first hot bonding area; and

wherein the flexible PCB comprises a first plane and a second plane opposite to the first plane, the first plane is divided into the touch button area and the control circuit area, and the flexible PCB further comprises a second hot bonding area, and the second hot bonding area is located on the second plane.

2. The touch-controlled electronic apparatus of claim 1, wherein the loading plate comprises a third plane and a fourth plane opposite to the third plane, and wherein the third plane is divided into the display touch area, the wire area, and the first hot bonding area;

and the second plane of the flexible PCB contacts and bonds to the third plane of the loading plate.

3. The touch-controlled electronic apparatus of claim 1, wherein the second hot bonding area overlays the first hot bonding area.

4. The touch-controlled electronic apparatus of claim 3, further comprising:

a first contact pad, disposed on the first hot bonding area; and

a second contact pad, disposed on the second hot bonding area;

wherein the first contact pad bonds to the second contact pad, and the control circuit is electrically connected to the touch panel via the first contact pad and the second contact pad.

5. The touch-controlled electronic apparatus of claim 1, wherein the sensor pad is composed of a copper material, and the copper material comprises a particular conductive pattern.

6. The touch-controlled electronic apparatus of claim 1, wherein the touch-controlled electronic apparatus is a mobile phone, a personal digital assistant (PDA), a PDA phone, or a smart phone.

7. A method for fabricating a touch-controlled electronic apparatus, comprising the steps of:

providing a loading plate having a display touch area, a wire area, and a first hot bonding area;

disposing a touch panel on the display touch area of the loading plate;

providing a flexible PCB having at least a touch button area and a control circuit area;

disposing a sensor pad on the touch button area of the flexible PCB, wherein the sensor pad is used as a touch button;

disposing a control circuit on the control circuit area of the flexible PCB, and electronically connecting the control circuit to the touch panel and the sensor pad; and

disposing and bonding the flexible PCB to the loading plate, such that the touch button area is disposed on at least one of the wire area and the first hot bonding area;

wherein the flexible PCB comprises a first plane and a second plane opposite to the first plane, the first plane is divided into the touch button area and the control circuit area, and the flexible PCB further comprises a second hot bonding area, and the second hot bonding area is located on the second plane.

8. The method of claim 7, wherein the loading plate comprises a third plane and a fourth plane opposite to the third plane, and wherein the third plane is divided into the display touch area, the wire area, and the first hot bonding area;

and the method further comprises the step of;

making the second plane of the flexible PCB contact and bond to the third plane of the loading plate.

9. The method of claim 8, wherein the flexible PCB further comprises a second hot bonding area located on the second plane;

and the method further comprises the step of;

disposing and bonding the flexible PCB to the loading plate, such that the second hot bonding area overlays the first hot bonding area.

10. The method of claim 9, wherein the touch-controlled electronic apparatus further comprises a first contact pad and a second contract pad, being respectively disposed on the first hot bonding area and the second hot bonding area;

and the method further comprises the step of;

disposing and bonding the flexible PCB on the loading plate, and bonding the first contact pad and the second contact pad; and

electrically connecting the control circuit to the touch panel by utilizing the first contact pad and the second contact pad.