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Headset electronics

  • US 8,867,758 B2
  • Filed: 05/14/2012
  • Issued: 10/21/2014
  • Est. Priority Date: 01/05/2007
  • Status: Active Grant
First Claim
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1. A wireless headset comprising:

  • an earbud assembly;

    an earbud flexible circuit board disposed within the earbud assembly and comprising;

    a first surface;

    a second surface; and

    a first circuit component mounted on a first portion of the first surface, wherein a second portion of the first surface is configured to face the mounted first circuit component;

    a primary housing assembly coupled to the earbud assembly and comprising;

    a headset component disposed within the primary housing assembly; and

    a primary flexible circuit board separate from the headset component and comprising a top surface and a bottom surface, wherein;

    a first portion of the top surface is configured to face a first portion of the headset component; and

    a second portion of the top surface is configured to face away from the first portion of the headset component.

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