Headset electronics
First Claim
1. A wireless headset comprising:
- an earbud assembly;
an earbud flexible circuit board disposed within the earbud assembly and comprising;
a first surface;
a second surface; and
a first circuit component mounted on a first portion of the first surface, wherein a second portion of the first surface is configured to face the mounted first circuit component;
a primary housing assembly coupled to the earbud assembly and comprising;
a headset component disposed within the primary housing assembly; and
a primary flexible circuit board separate from the headset component and comprising a top surface and a bottom surface, wherein;
a first portion of the top surface is configured to face a first portion of the headset component; and
a second portion of the top surface is configured to face away from the first portion of the headset component.
1 Assignment
0 Petitions
Accused Products
Abstract
A wireless headset device that includes an earbud assembly and a primary housing assembly, fixed to the earbud assembly, is provided. The earbud assembly can include an earbud flexible circuit board having mounted thereon a receiver and processing circuitry. The primary housing assembly can include a microphone and a primary housing flexible circuit board electrically coupled to the earbud circuit board and the microphone. In some embodiments, the headset device can include at least one flexible circuit board and the primary housing can include a connector assembly. The at least one flexible circuit board can be electrically coupled to the connector assembly and can include Universal Serial Bus (USB) circuitry operative to process USB protocol communications and serial circuitry operative to process serial protocol communications.
-
Citations
12 Claims
-
1. A wireless headset comprising:
-
an earbud assembly; an earbud flexible circuit board disposed within the earbud assembly and comprising; a first surface; a second surface; and a first circuit component mounted on a first portion of the first surface, wherein a second portion of the first surface is configured to face the mounted first circuit component; a primary housing assembly coupled to the earbud assembly and comprising; a headset component disposed within the primary housing assembly; and a primary flexible circuit board separate from the headset component and comprising a top surface and a bottom surface, wherein; a first portion of the top surface is configured to face a first portion of the headset component; and a second portion of the top surface is configured to face away from the first portion of the headset component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
Specification