Fingerprint sensing assemblies and methods of making
First Claim
Patent Images
1. A fingerprint sensing module comprising:
- a sensor substrate forming a unified solid structure having a sensor substrate sensing side surface on one side of the substrate structure configured to receive a finger swipe in a finger swipe region of the sensor substrate sensing side and a sensor substrate circuit side surface on the opposite side of the substrate structure from the sensor substrate sensing side;
an image sensor including conductive traces formed on the sensor substrate circuit side surface of the sensor substrate, in the finger swipe region of the sensor substrate, wherein the sensor substrate structure intermediate the sensor substrate sensing side surface and the sensor substrate circuit side surface insulates the conductive traces from a finger of a user during the finger swipe in the finger swipe region of the sensor substrate; and
a sensor circuit including at least one integrated circuit mounted on the circuit side surface of the sensor substrate, separated from the image sensor conductive traces of the image sensor in the finger swipe region of the sensor substrate and electrically connected to the conductive traces of the image sensor in the finger swipe region of the sensor substrate circuit side.
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Abstract
A fingerprint sensing module includes a sensor substrate having a sensing side and a circuit side, an image sensor including conductive traces on the circuit side of the sensor substrate, and a sensor circuit including at least one integrated circuit mounted on the circuit side of the sensor substrate and electrically connected to the image sensor. The sensor substrate may be a flexible substrate. The module may include a velocity sensor on the sensor substrate or on a separate substrate. The module may further include a rigid substrate, and the sensor substrate may be affixed to the rigid substrate.
492 Citations
36 Claims
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1. A fingerprint sensing module comprising:
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a sensor substrate forming a unified solid structure having a sensor substrate sensing side surface on one side of the substrate structure configured to receive a finger swipe in a finger swipe region of the sensor substrate sensing side and a sensor substrate circuit side surface on the opposite side of the substrate structure from the sensor substrate sensing side; an image sensor including conductive traces formed on the sensor substrate circuit side surface of the sensor substrate, in the finger swipe region of the sensor substrate, wherein the sensor substrate structure intermediate the sensor substrate sensing side surface and the sensor substrate circuit side surface insulates the conductive traces from a finger of a user during the finger swipe in the finger swipe region of the sensor substrate; and a sensor circuit including at least one integrated circuit mounted on the circuit side surface of the sensor substrate, separated from the image sensor conductive traces of the image sensor in the finger swipe region of the sensor substrate and electrically connected to the conductive traces of the image sensor in the finger swipe region of the sensor substrate circuit side. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A fingerprint sensing module comprising:
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a sensor substrate having a sensing side to receive a finger swipe and a circuit side, opposite the sensing side; an image sensor including conductive traces formed on the circuit side of the sensor substrate, wherein the sensor substrate isolates the conductive traces from the finger swipe; and a sensor circuit including at least one integrated circuit mounted on the circuit side of the sensor substrate separated from the conductive traces and electrically connected to the image sensor; and
,a velocity sensor including conductive traces on the circuit side of the sensor substrate, wherein the velocity sensor is electrically connected to the sensor circuit; wherein the velocity sensor comprises two or more finger detectors spaced apart along a direction of movement of the finger, each of the finger detectors including at least one drive plate and at least one pickup plate, wherein an end of the finger passing over each of the finger detectors produces a change in capacitance between respective drive plate and pickup plate.
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23. A fingerprint sensing module comprising:
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a sensor substrate having a sensing side to receive a finger swipe and a circuit side, opposite the sensing side; an image sensor including conductive traces formed on the circuit side of the sensor substrate, wherein the sensor substrate isolates the conductive traces from the finger swipe; and a sensor circuit including at least one integrated circuit mounted on the circuit side of the sensor substrate separated from the conductive traces and electrically connected to the image sensor; and
,a flexible substrate having a velocity sensor including conductive traces on the flexible substrate, wherein the velocity sensor is electrically connected to the sensor circuit, and a base for mounting the sensor substrate and the flexible substrate such that the image sensor and the velocity sensor are substantially coplanar.
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24. A fingerprint sensing module comprising:
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a flexible substrate having a sensing side to receive a finger swipe and a circuit side, opposite the sensing side; an image sensor including conductive traces formed on the circuit side of the flexible substrate, wherein the flexible substrate isolates the conductive traces from the finger swipe; a velocity sensor including conductive traces formed on the circuit side of the flexible substrate; a sensor circuit including at least one integrated circuit mounted on the circuit side of the flexible substrate separated from the conductive traces and electrically connected to the image sensor and the velocity sensor; and a rigid substrate, wherein the circuit side of the flexible substrate is affixed to a surface of the rigid substrate.
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25. A fingerprint sensing module comprising:
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a rigid substrate; an image sensor including at least one conductive transmitter trace and at least one receiver conductive trace formed on the substrate, wherein the image sensor comprises a linear array of passive impedance modification capacitive gap sensors for sensing the variation in the modification of a transmitted drive signal transmitted across the gap from the at least one conductive transmitter trace and received by the at least one receiver trace due to the presence of ridge peaks and ridge valleys of a fingerprint over the gap; and a sensor circuit including at least one integrated circuit mounted on the substrate separated from the conductive traces and electrically connected to the image sensor and the velocity sensor, wherein the image sensor, the velocity sensor and the sensor circuit are mounted on a first surface of the rigid substrate. - View Dependent Claims (26, 27, 28)
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29. A method for making a fingerprint sensing module, comprising:
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providing a flexible substrate having a sensing side to receive a finger swipe and a circuit side, opposite the sensing side; forming an image sensor including conductive traces on the circuit side of the flexible substrate, wherein the flexible substrate isolates the conductive traces from the finger swipe; forming a velocity sensor including conductive traces on the circuit side of the flexible substrate; mounting a sensor circuit including at least one integrated circuit on the circuit side of the flexible substrate separated from the conductive traces; and affixing the circuit side of the flexible substrate to a surface of a rigid substrate.
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30. A fingerprint sensing module comprising:
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a sensor substrate, formed of a flexible film, forming a unified solid structure having a sensor substrate sensing side surface on one side of the substrate structure configured to receive a finger swipe in a finger swipe region of the sensor substrate sensing side, on or in the vicinity of the sensor substrate and a sensor substrate circuit side surface on the opposite side of the substrate structure from the sensor substrate sensing side; an image sensor including conductive traces formed on the sensor substrate circuit side surface of the sensor substrate, in the finger swipe region of the sensor substrate, wherein the sensor substrate structure intermediate the sensor substrate sensing side surface and the sensor substrate circuit side surface insulates the conductive traces from a finger of the user during the finger swipe in the finger swipe region of the sensor substrate; and a sensor circuit including at least one integrated circuit mounted on the circuit side surface of the sensor substrate, separated from the image sensor conductive traces of the image sensor in the finger swipe region of the sensor substrate and electrically connected to the conductive traces of the image sensor in the finger swipe region of the sensor substrate circuit side. - View Dependent Claims (31, 32)
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33. A fingerprint sensing module comprising:
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a sensor substrate having a sensing side to receive a finger swipe and a circuit side, opposite the sensing side; an image sensor including conductive traces formed on the circuit side of the sensor substrate, wherein the sensor substrate isolates the conductive traces from the finger swipe; a sensor circuit including at least one integrated circuit mounted on the circuit side of the sensor substrate separated from the conductive traces and electrically connected to the image sensor; a velocity sensor including conductive traces on the circuit side of the sensor substrate, wherein the velocity sensor is electrically connected to the sensor circuit; and wherein the velocity sensor comprises two or more finger detectors spaced apart along a direction of movement of the finger, each of the finger detectors including at least one drive plate and at least one pickup plate, wherein an end of the finger passing over each of the finger detectors produces a change in capacitance between respective drive plates and pickup plates.
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34. A fingerprint sensing module comprising:
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a sensor substrate having a sensing side to receive a finger swipe and a circuit side, opposite the sensing side; an image sensor including conductive traces formed on the circuit side of the sensor substrate, wherein the sensor substrate isolates the conductive traces from the finger swipe; a sensor circuit including at least one integrated circuit mounted on the circuit side of the sensor substrate separated from the conductive traces and electrically connected to the image sensor; a velocity sensor including conductive traces on the circuit side of the sensor substrate, wherein the velocity sensor is electrically connected to the sensor circuit; and wherein the sensor substrate comprises a rigid substrate.
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35. A fingerprint sensing module comprising:
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a rigid substrate; an image sensor including conductive traces formed on the substrate, wherein the image sensor comprises a linear array of capacitive sensors for capacitive sensing of ridge peaks and ridge valleys of a fingerprint on a moving finger; a velocity sensor including conductive traces formed on the substrate; a sensor circuit including at least one integrated circuit mounted on the substrate separated from the conductive traces and electrically connected to the image sensor and the velocity sensor, wherein the image sensor, the velocity sensor and the sensor circuit are mounted on a first surface of the rigid substrate; a protective coating over the image sensor and the velocity sensor; and wherein the image sensor comprises an image pickup plate disposed generally orthogonally to a direction of movement of the finger, and a plurality of image drive plates in spaced relation to the image pickup plate to define a plurality of sensor gaps between respective image drive plates and the image pickup plate, wherein the ridge peaks and ridge valleys of the fingerprint passing over the sensor gaps produce a change in capacitance between respective image drive plates and the image pickup plate. - View Dependent Claims (36)
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Specification