Feed through interconnect assembly for an implantable stimulation system and methods of making and using
First Claim
1. A method of making a stimulation device comprising:
- coupling a feed through interconnect assembly to a lead connector configured and arranged to receive a lead having at least one electrode disposed thereon, wherein the feed through interconnect assembly comprises an assembly frame and plurality of feed through interconnects attached to the assembly frame, wherein each of the plurality of feed through interconnects comprises a first contact pad and a second contact pad, and wherein a tab is formed on the first contact pad of at least one of the plurality of feed through interconnects;
coupling the feed through interconnect assembly to an implantable pulse generator comprising a sealed chamber, an electronic subassembly disposed in the sealed chamber and a plurality of feed through pins coupled to the electronic subassembly and extending out of the sealed chamber;
coupling the plurality of feed through interconnects to the plurality of feed through pins; and
severing the assembly frame from the plurality of feed through interconnects after the feed through interconnect assembly is coupled to the lead connector;
wherein coupling the plurality of feed through interconnects to the plurality of feed through pins comprises coupling the plurality of feed through interconnects to portions of the plurality of feed through pins that are disposed entirely external to the sealed chamber.
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Abstract
A stimulation system includes an implantable pulse generator having a sealed chamber and an electronic subassembly disposed in the sealed chamber. Feed through pins are coupled to the electronic subassembly and extend out of the sealed chamber. Feed through interconnects are coupled to the electronic subassembly via the feed through pins. At least one tab is disposed on at least one feed through interconnect. The tab(s) are configured and arranged to flex away from the feed through interconnect and against a side of the feed through pin.
A feed through interconnect assembly includes an assembly frame; feed through interconnects extending from the assembly frame; a first contact pad and a second contact pad disposed on at least one of the feed through interconnects; and a tab formed on a first contact pad of at least one of the feed through interconnects.
35 Citations
19 Claims
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1. A method of making a stimulation device comprising:
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coupling a feed through interconnect assembly to a lead connector configured and arranged to receive a lead having at least one electrode disposed thereon, wherein the feed through interconnect assembly comprises an assembly frame and plurality of feed through interconnects attached to the assembly frame, wherein each of the plurality of feed through interconnects comprises a first contact pad and a second contact pad, and wherein a tab is formed on the first contact pad of at least one of the plurality of feed through interconnects; coupling the feed through interconnect assembly to an implantable pulse generator comprising a sealed chamber, an electronic subassembly disposed in the sealed chamber and a plurality of feed through pins coupled to the electronic subassembly and extending out of the sealed chamber; coupling the plurality of feed through interconnects to the plurality of feed through pins; and severing the assembly frame from the plurality of feed through interconnects after the feed through interconnect assembly is coupled to the lead connector; wherein coupling the plurality of feed through interconnects to the plurality of feed through pins comprises coupling the plurality of feed through interconnects to portions of the plurality of feed through pins that are disposed entirely external to the sealed chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification