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Feed through interconnect assembly for an implantable stimulation system and methods of making and using

  • US 8,869,392 B2
  • Filed: 06/15/2012
  • Issued: 10/28/2014
  • Est. Priority Date: 09/18/2006
  • Status: Expired due to Fees
First Claim
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1. A method of making a stimulation device comprising:

  • coupling a feed through interconnect assembly to a lead connector configured and arranged to receive a lead having at least one electrode disposed thereon, wherein the feed through interconnect assembly comprises an assembly frame and plurality of feed through interconnects attached to the assembly frame, wherein each of the plurality of feed through interconnects comprises a first contact pad and a second contact pad, and wherein a tab is formed on the first contact pad of at least one of the plurality of feed through interconnects;

    coupling the feed through interconnect assembly to an implantable pulse generator comprising a sealed chamber, an electronic subassembly disposed in the sealed chamber and a plurality of feed through pins coupled to the electronic subassembly and extending out of the sealed chamber;

    coupling the plurality of feed through interconnects to the plurality of feed through pins; and

    severing the assembly frame from the plurality of feed through interconnects after the feed through interconnect assembly is coupled to the lead connector;

    wherein coupling the plurality of feed through interconnects to the plurality of feed through pins comprises coupling the plurality of feed through interconnects to portions of the plurality of feed through pins that are disposed entirely external to the sealed chamber.

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