Pinch valve and method for manufacturing same

• US 8,869,815 B2
• Filed: 04/23/2009
• Issued: 10/28/2014
• Est. Priority Date: 06/10/2008
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Schmidt, Manuela, Rupp, Jochen
• Primary Examiner(s): Hepperle, Stephen M
• Assistant Examiner(s): ARUNDALE, ROBERT K
• Application Number:
  US12/994,919
• Publication Number:
  US 20110076204A1
• Time in Patent Office: 2,014 Days
• Field of Search: 137/828, 137/833, 137/15.19
• US Class Current: 137/15.19
• CPC Class Codes: F04B 43/12 having peristaltic action
• CPC Class Codes: F16K 2099/008 Multi-layer fabrications
• CPC Class Codes: F16K 2099/0094 Micropumps
• CPC Class Codes: F16K 99/0001 Microvalves microdevices B81B1/00; manufacture or treatment of devices or systems in or on a substrate B81C1/00; microfluidic structures B01L3/5027; micropumps F04B19/006
• CPC Class Codes: F16K 99/0015 Diaphragm or membrane valves
• CPC Class Codes: F16K 99/0044 using thermo-electric means
• CPC Class Codes: F16K 99/0057 the fluid being the circulating fluid itself, e.g. check valves
• CPC Class Codes: F16K 99/0059 actuated by a pilot fluid
• CPC Class Codes: F16K 99/0061 actuated by an expanding gas or liquid volume
• CPC Class Codes: Y10T 137/0497 Fluid actuated or retarded
• CPC Class Codes: Y10T 137/2196 Acoustical or thermal energy
• CPC Class Codes: Y10T 137/2224 Structure of body of device
• CPC Class Codes: Y10T 137/7762 Fluid pressure type
• CPC Class Codes: Y10T 29/49412 with assembly, disassembly or composite article making

Abstract

A pinch valve, a chip including the pinch valve, a peristaltic pump including the pinch valve and a method for manufacturing the pinch valve. The pinch valve includes a first substrate, a second substrate, and a third substrate. The third substrate is formed from an elastic material and situated between the first and second substrates. The first substrate adjoins the third substrate and includes at least one first recess on the side adjacent to the third substrate. The second substrate adjoins the third substrate and includes at least one second recess on the side adjacent to the third substrate. The first recess and the second recess are situated at least partially opposite each other.

Claims

1. A method for manufacturing a pinch valve, the method comprising:

providing a first substrate and a second substrate, each having at least one recess;

providing a third elastic substrate;

connecting the first substrate to the third substrate and connecting the third substrate to the second substrate;

wherein the pinch valve is a microfluidic pinch valve, which includes;

the first substrate;

the second substrate; and

the third substrate;

wherein the third substrate is formed from an elastic material and is situated between the first substrate and the second substrate;

wherein the first substrate adjoins the third substrate and has at least one first recess on a side of the first substrate that is adjacent to the third substrate;

wherein the second substrate adjoins the third substrate and has at least one second recess on a side of the second substrate that is adjacent to the third substrate;

wherein the first recess and the second recess are situated at least partially opposite each other;

prior to connecting the third substrate to the first substrate and the second substrate, forming an energy director structure on at least one of the first substrate, the second substrate, and the third substrate; and

using ultrasonic welding to connect the third substrate to the first and the second substrates, wherein each energy director structure pinches the third substrate between the first and the second substrates and causes the welding to occur at a location of the energy director structure.

2. A method for manufacturing a pinch valve, the method comprising:

providing a first substrate and a second substrate, each having at least one recess;

providing a third elastic substrate;

connecting the first substrate to the third substrate and connecting the third substrate to the second substrate, wherein the third substrate is connected to the first substrate and the second substrate using laser beam welding, wherein at least one of the first substrate, the second substrate, and the third substrate includes at least one joint line made from at least one of a black dye and another absorber, the laser beam welding occurring at the at least one joint line, which joint line at least partially surrounds at least one of the first recess and the second recess;

wherein the pinch valve is a microfluidic pinch valve, which includes;

the first substrate;

the second substrate; and

the third substrate;

wherein the third substrate is formed from an elastic material and is situated between the first substrate and the second substrate;

wherein the first substrate adjoins the third substrate and has at least one first recess on a side of the first substrate that is adjacent to the third substrate;

wherein the second substrate adjoins the third substrate and has at least one second recess on a side of the second substrate that is adjacent to the third substrate;

wherein the first recess and the second recess are situated at least partially opposite each other; and

printing the at least one joint line on at least one of;

the side of the first substrate adjacent to the third substrate, and to at least partially surround the first recess;

the side of the second substrate adjacent to the third substrate, and to at least partially surround the second recess;

the side of the third substrate adjacent to the first substrate, and to at least partially surround the first recess; and

the side of the third substrate adjacent to the second substrate, and to at least partially surround the second recess.

3. The method of claim 2, further comprising forming the pinch valve to be partially or completely closable or openable, by an external pressure device.

4. The method of claim 2, further comprising connecting the first recess to an electrically heatable pressure chamber, which is integrated into the first substrate.

5. The method of claim 4, further comprising:

providing a heating spiral in the pressure chamber, and

connecting the heating spiral to an external voltage and/or current supply device via two conductor tracks fed through the first substrate.

6. The method of claim 2, further comprising:

forming, in the second substrate, at least one third recess which is situated next to the second recess on the side of the second substrate adjacent to the third substrate, and

placing the second recess and the third recess at least partially opposite the first recess.

7. The method of claim 2, further comprising forming the third substrate from an elastomer film.

8. The method of claim 2, further comprising forming at least one of the first substrate, the second substrate and the third substrate from a thermoplastic elastomer.

9. The method of claim 2, further comprising:

using thermal compression welding to connect the third substrate to the first and the second substrates, and

selecting materials for the first, the second and the third substrate, such that at least one of a melting temperature and a softening temperature of the third substrate is lower than corresponding melting or softening temperatures of the first substrate and the second substrate.

10. The method of claim 2, wherein the third substrate is welded only around a perimeter of each recess.

11. A method for manufacturing a pinch valve, the method comprising:

providing a first substrate and a second substrate, each having at least one recess;

providing a third elastic substrate;

connecting the first substrate to the third substrate and connecting the third substrate to the second substrate;

wherein the pinch valve is a microfluidic pinch valve, which includes;

the first substrate;

the second substrate; and

the third substrate;

wherein the third substrate is formed from an elastic material and is situated between the first substrate and the second substrate;

wherein the first substrate adjoins the third substrate and has at least one first recess on a side of the first substrate that is adjacent to the third substrate;

wherein the second substrate adjoins the third substrate and has at least one second recess on a side of the second substrate that is adjacent to the third substrate;

wherein the first recess and the second recess are situated at least partially opposite each other; and

prior to connecting the third substrate to the first and the second substrates, introducing a heat-sensitive reagent into a channel formed by the second recess.