Wireless IC device and method for manufacturing same

• US 8,870,077 B2
• Filed: 02/08/2011
• Issued: 10/28/2014
• Est. Priority Date: 08/19/2008
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kato, Noboru
• Primary Examiner(s): STANFORD, CHRISTOPHER J
• Application Number:
  US13/022,693
• Publication Number:
  US 20110127336A1
• Time in Patent Office: 1,358 Days
• Field of Search: 235/492, 340 101- 102, 3405721-5727, 343/702
• US Class Current: 235/492
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 19/30 the primary active element being centre-fed and substantially straight, e.g. Yagi antenna
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

A wireless IC device which functions as a non-contact RFID system even when the wireless IC device is attached to an article containing metal, water, salt or the like, without hindering reduction in size and thickness, and a method for manufacturing the same are obtained. The wireless IC device includes a wireless IC chip arranged to process a predetermined wireless signal, a feed circuit board on which the wireless IC chip is mounted, a loop-shaped electrode that is coupled to the wireless IC chip via the feed circuit board, and a first electrode plate and a second electrode plate that are coupled to the loop-shaped electrode. The loop-shaped electrode is sandwiched between the first electrode plate and the second electrode plate and is arranged such that the loop surface thereof is perpendicular to or tilted with respect to the first and the second electrode plates. At least the first electrode plate out of the first electrode plate and the second electrode plate is used for transmission and reception of the wireless signal.

Claims

1. A wireless integrated circuit device comprising:

a wireless integrated circuit arranged to process a predetermined wireless signal;

a loop-shaped electrode coupled to the wireless integrated circuit and including a coupling portion; and

a first metallic electrode plate and a second metallic electrode plate coupled to the loop-shaped electrode, the second metallic electrode plate having an area larger than an area of the first metallic electrode plate;

wherein

the wireless integrated circuit and the loop-shaped electrode are sandwiched between the first metallic electrode plate and the second metallic electrode plate;

the loop-shaped electrode is arranged such that a loop surface thereof is perpendicular to or tilted with respect to the first metallic electrode plate and the second metallic electrode plate;

the loop-shaped electrode is directly electrically connected to the first metallic electrode plate via the coupling portion and is electromagnetically coupled to the second metallic electrode plate; and

the first and second metallic electrode plates are used for transmission and reception of the wireless signal.

2. The wireless integrated circuit device according to claim 1, wherein the loop-shaped electrode and the first metallic electrode plate are electrically coupled to each other, and the loop-shaped electrode and the second metallic electrode plate are electromagnetically coupled to each other.

3. The wireless integrated circuit device according to claim 1, wherein a feed circuit board including a feed circuit including a resonance circuit that operates at a predetermined resonant frequency is provided between the wireless integrated circuit and the loop-shaped electrode.

4. The wireless integrated circuit device according to claim 3, wherein the feed circuit includes inductance elements, and the feed circuit board and the loop-shaped electrode are electromagnetically coupled to each other via the inductance elements.

5. The wireless integrated circuit device according to claim 1, wherein at least a portion of a metallic article is used as the second metallic electrode plate.

6. A method for manufacturing a wireless integrated circuit device that includes a wireless integrated circuit arranged to process a predetermined wireless signal, a loop-shaped electrode coupled to the wireless integrated circuit and including a coupling portion, and a first metallic electrode plate and a second metallic electrode plate coupled to the loop-shaped electrode, the second metallic electrode plate having an area larger than an area of the first metallic electrode plate, wherein the wireless integrated circuit and the loop-shaped electrode are sandwiched between the first metallic electrode plate and the second metallic electrode plate, the loop-shaped electrode is arranged such that a loop surface thereof is perpendicular to or tilted with respect to the first metallic electrode plate and the second metallic electrode plate, the loop-shaped electrode is directly electrically connected to the first metallic electrode plate via the coupling portion and is electromagnetically coupled to the second metallic electrode plate, and the first and second metallic electrode plates are used for transmission and reception of the wireless signal, the method comprising the steps of:

patterning the first metallic electrode plate and the loop-shaped electrode on a sheet of a metallic plate; and

bending the loop-shaped electrode so as to be perpendicular to or tilted with respect to the first metallic electrode plate.