RFID antenna modules and methods

• US 8,870,080 B2
• Filed: 02/01/2013
• Issued: 10/28/2014
• Est. Priority Date: 08/12/2010
• Status: Active Grant

• Current Assignee: AmaTech Group Limited (Paragon Group Limited)
• Original Assignee: Féinics AmaTech Teoranta (Paragon Group Limited)
• Inventors: Finn, David
• Primary Examiner(s): Haupt, Kristy A
• Application Number:
  US13/756,631
• Publication Number:
  US 20130140370A1
• Time in Patent Office: 634 Days
• Field of Search: 235/492
• US Class Current: 235/492
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: G06K 19/07769 the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
• CPC Class Codes: G06K 19/07773 Antenna details antennas for wireless devices, e.g. RFID tags, in general H01Q1/22
• CPC Class Codes: G06K 19/07794 the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/2076 equal to or larger than 100 microns
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

An RFID chip (CM) is flip-chip mounted and connected to a surface of a substrate (MT), such as for a 6-pad ISO smart card antenna module (AM). A winding core (WC) for an antenna (MA) stiffens, stabilizes and planarizes substrate (MT) to enhance reliability of the connections. The flip-chip antenna module (FCAM) interfaces with a contactless reader. Contact pads (CP) on the opposite side of the substrate (MT) provide a contact interface. Also disclosed is first forming an antenna (MA) on an antenna substrate (AS), then joining it to the module substrate (MT). Such an antenna may be an embedded wire, or an etched metal layer.

Claims

1. An antenna module (AM) for a smart card (SC) comprising:

a substrate (MT);

a chip (CM) disposed on a surface of the substrate (MT) and flip-chip connected to pads on the surface of the substrate (MT); and

an antenna (MA) disposed on the surface of the substrate (MT), and connected with the chip (CM);

characterized by;

a support structure (DS, WC) secured to the surface of the substrate (MT), serving as a winding core for the antenna (MA);

wherein the support structure (DS, WC) comprises a tubular body portion (B) having two opposite open ends, one of which is secured to the surface of the substrate (MT), the other of which is a free end; and

wherein the support structure serves as a dam for glob-top (GT) covering at least the chip (CM) within the support structure.

2. The antenna module (AM) of claim 1, wherein:

the support structure (WC) has a flange (F) disposed around the free end of the body portion (B).

3. The antenna module (AM) of claim 1, further comprising:

a mold mass (MM) covering the chip (CM), the support structure (DS, WC) and the antenna (MA).

4. The antenna module (AM) of claim 1, further comprising:

contact pads (CP) on an opposite surface of the substrate (MT) for a contact interface.

5. A smart card (SC) comprising the antenna module (AM) of claim 1, and further comprising:

a card body (CB);

a booster antenna (BA) having an outer portion disposed around a periphery of the card body (CB); and

a coupler coil (CC) disposed at an interior area of the card body (CB);

wherein the antenna module (AM) is disposed at the interior area of the card body (CB) for inductive coupling of the antenna (MA) with the coupler coil (CC).

6. The smart card (SC) of claim 5, wherein:

a recess (R) is provided in the card body (CB) for receiving the antenna module (AM).

7. A method of making an antenna module (AM) comprising:

flip chip mounting and bonding a chip (CM) to a substrate (MT);

characterized by;

affixing a tubular support structure (DS, WC) having two opposite open ends on a surface of the substrate (MT); and

after affixing the tubular support structure on the surface of the module tape (MT), winding a wire for an antenna (MA) around the tubular support structure (DS, WC).

8. The method of claim 7, further comprising:

prior to mounting and bonding the chip to the substrate, applying a conductive material to at least one of bumps on the chip and pads on the substrate.

9. The method of claim 8, wherein:

the conductive material comprises silver nanowires.

10. The method of claim 7, further comprising:

winding the antenna (MA) using a flyer winding technique.

11. An antenna module (AM) suitable for being disposed in a card body (CB) of a smart card (SC) comprising:

a module substrate (MT); and

a chip (CM) disposed on a surface of the module substrate (MT);

characterized by;

an antenna (MA) disposed on an antenna substrate (AS) which is separate from the module substrate (MT);

an opening (OP) in the antenna substrate (AS) for accommodating the chip (CM) when the antenna substrate (AS) is joined to the module substrate (MT).

12. The antenna module (AM) of claim 11, wherein:

the chip (CM) is and flip-chip mounted and connected to module substrate (MT).

13. The antenna module (AM) of claim 11, wherein:

the antenna (MA) comprises wire embedded in the antenna substrate (AS).

14. The antenna module (AM) of claim 11, wherein:

the antenna (MA) is etched from a metal layer on the antenna substrate (AS).

15. The antenna module (AM) of claim 11, wherein:

etching is performed using a laser.