Method for manufacturing on a film substrate at a temperature above its glass transition

• US 8,871,298 B2
• Filed: 02/07/2007
• Issued: 10/28/2014
• Est. Priority Date: 02/08/2006
• Status: Expired due to Fees

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Roehrig, Mark A., Liu, Yufeng, Peterson, Robert W.
• Primary Examiner(s): WOLLSCHLAGER, JEFFREY MICHAEL
• Application Number:
  US12/278,431
• Publication Number:
  US 20090155458A1
• Time in Patent Office: 2,820 Days
• Field of Search: None
• US Class Current: 427/171
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/40 Thermal treatment, e.g. annealing in the presence of a solvent vapour
• CPC Class Codes: H10K 77/111 Flexible substrates
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A method for preparing a flexible film substrate with a low glass transition temperature can be used in the production of an article that retains dimensions and improves the surface smoothness after high temperature processing. The invention, for example, would enable low temperature films such as PET and PEN to be dimensionally stable and ultra flat at conditions commonly used in electronic processing which can typically exceed 200° C. More specifically, the methods enable the use of e.g. barrier films based on PET or PEN in OLED/PLED manufacturing.

Claims

1. A method for elevated temperature processing of a film, comprising:

providing a film comprising a polymeric substrate having a glass transition temperature under about 200°

C., and further comprising at least one layer of metal oxide and at least one layer of coated polymer;

clamping the film so as to place the clamped film under tension in at least two orthogonal directions; and

holding the clamped film flat in a zero strain condition while subjecting the clamped film to elevated temperature processing comprising heating the clamped film in the zero strain condition above the glass transition temperature of the polymeric substrate, wherein the clamped film does not show any visible curl or distortion when unclamped after said elevated temperature processing.

2. The method according to claim 1 further comprising depositing an organic hole-transport layer onto the clamped film.

3. The method according to claim 1 further comprising depositing a layer of a transparent conductive material onto the clamped film.

4. The method according to claim 3 wherein the transparent conductive material is indium-tin oxide.

5. The method according to claim 1 further comprising cooling the clamped film below the glass transition temperature of the polymeric substrate.

6. The method according to claim 1 wherein the glass transition temperature is under about 120°

C.

7. The method according to claim 6 wherein the polymeric substrate is selected from the group consisting of PET, PEN, and copolymers thereof.

8. The method according to claim 1 wherein the tension in the at least two orthogonal directions is sufficient to prevent sagging of the clamped film during the heating.

9. The method according to claim 1 wherein the provided film has a biaxial orientation, and wherein the at least two orthogonal directions are aligned with the biaxial orientation.

10. The method according to claim 1 wherein after the heating the substrate has an average surface roughness less than 10 nm.

11. The method according to claim 1 wherein after the heating the substrate has a water vapor transport rate (WVTR) of less than 0.005 g/m²/day.

12. The method according to claim 1 wherein after the heating the substrate displays a shrinkage of less than 0.01% in at least two orthogonal directions.

13. The method according to claim 1 further comprising unclamping the clamped film to provide an unclamped film and depositing a layer of a transparent conductive material onto the unclamped film.

14. The method according to claim 1 further comprising unclamping the clamped film to provide an unclamped film and depositing a layer of an organic hole-transport layer onto the unclamped film.

15. The method of claim 1, wherein heating the clamped film above the glass transition temperature of the polymeric substrate is carried out above about 180°

C.

16. The method of claim 1, wherein the method is used to make a device taken from the group consisting of:

an OLED display, liquid crystal display, electrochromic display, thin film transistor device, flexible solar cell, photovoltaics, illumination devices and signage.