Method for molecular adhesion bonding at low pressure
First Claim
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1. A method for bonding at least a first wafer and a second wafer by molecular adhesion, which comprises:
- placing the first and second wafers in an environment having a first pressure (P1) greater than a predetermined threshold pressure above which initiation of a bonding wave propagation is prevented, and then bringing the first wafer and the second wafer into alignment and contact; and
spontaneously initiating the propagation of a bonding wave between the first and second wafers after the wafers are in contact solely by reducing the pressure within the environment to a second pressure (P2) below the threshold pressure.
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Abstract
A method for bonding first and second wafers by molecular adhesion. The method includes placing the wafers in an environment having a first pressure (P1) greater than a predetermined threshold pressure above which initiation of bonding wave propagation is prevented, bringing the first wafer and the second wafer into alignment and contact, and spontaneously initiating the propagation of a bonding wave between the wafers after they are in contact solely by reducing the pressure within the environment to a second pressure (P2) below the threshold pressure.
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14 Claims
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1. A method for bonding at least a first wafer and a second wafer by molecular adhesion, which comprises:
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placing the first and second wafers in an environment having a first pressure (P1) greater than a predetermined threshold pressure above which initiation of a bonding wave propagation is prevented, and then bringing the first wafer and the second wafer into alignment and contact; and spontaneously initiating the propagation of a bonding wave between the first and second wafers after the wafers are in contact solely by reducing the pressure within the environment to a second pressure (P2) below the threshold pressure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification