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Method for molecular adhesion bonding at low pressure

  • US 8,871,611 B2
  • Filed: 10/30/2013
  • Issued: 10/28/2014
  • Est. Priority Date: 08/11/2010
  • Status: Active Grant
First Claim
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1. A method for bonding at least a first wafer and a second wafer by molecular adhesion, which comprises:

  • placing the first and second wafers in an environment having a first pressure (P1) greater than a predetermined threshold pressure above which initiation of a bonding wave propagation is prevented, and then bringing the first wafer and the second wafer into alignment and contact; and

    spontaneously initiating the propagation of a bonding wave between the first and second wafers after the wafers are in contact solely by reducing the pressure within the environment to a second pressure (P2) below the threshold pressure.

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