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Integrated power module package

  • US 8,872,328 B2
  • Filed: 12/19/2012
  • Issued: 10/28/2014
  • Est. Priority Date: 12/19/2012
  • Status: Active Grant
First Claim
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1. An integrated power module, comprising:

  • a substantially planar insulated metal substrate having at least one cut-out region;

    at least one substantially planar ceramic substrate disposed within the cut-out region, wherein the ceramic substrate is framed on at least two sides by the insulated metal substrate, the ceramic substrate including a first metal layer on a first side and a second metal layer on a second side;

    at least one power semiconductor device coupled to the first side of the ceramic substrate;

    at least one control device coupled to a first surface of the insulated metal substrate;

    a power overlay electrically connecting the at least one semiconductor power device and the at least one control device; and

    a cooling fluid reservoir operatively connected to the second metal layer of the at least one ceramic substrate, wherein a plurality of cooling fluid passages are provided in the cooling fluid reservoir.

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