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Thin-film semiconductor component and component assembly

  • US 8,872,330 B2
  • Filed: 07/16/2007
  • Issued: 10/28/2014
  • Est. Priority Date: 08/04/2006
  • Status: Expired due to Fees
First Claim
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1. A thin-film semiconductor component comprising:

  • a carrier layer, wherein the carrier layer is a film;

    a layer stack arranged on the carrier layer, the layer stack containing a semiconductor material and configured to emit radiation; and

    a heat dissipating layer configured to cool the thin-film semiconductor component and applied on the carrier layer, the heat dissipating layer being arranged between the carrier layer and the layer stack,wherein the thin-film semiconductor component is free of a growth substrate used for growing the layer stack,wherein the heat-dissipating layer is embodied as a closed area,wherein side edges bounding the closed area run in curved fashion,wherein the heat-dissipating layer comprises an indented side edge and a bulgy side edge opposite to the indented side edge, andwherein the layer stack is arranged at the indented side edge.

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