Thin-film semiconductor component and component assembly
First Claim
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1. A thin-film semiconductor component comprising:
- a carrier layer, wherein the carrier layer is a film;
a layer stack arranged on the carrier layer, the layer stack containing a semiconductor material and configured to emit radiation; and
a heat dissipating layer configured to cool the thin-film semiconductor component and applied on the carrier layer, the heat dissipating layer being arranged between the carrier layer and the layer stack,wherein the thin-film semiconductor component is free of a growth substrate used for growing the layer stack,wherein the heat-dissipating layer is embodied as a closed area,wherein side edges bounding the closed area run in curved fashion,wherein the heat-dissipating layer comprises an indented side edge and a bulgy side edge opposite to the indented side edge, andwherein the layer stack is arranged at the indented side edge.
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Abstract
A thin-film semiconductor component having a carrier layer and a layer stack which is arranged on the carrier layer, the layer stack containing a semiconductor material and being provided for emitting radiation, wherein a heat dissipating layer provided for cooling the semiconductor component is applied on the carrier layer. A component assembly is also disclosed.
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Citations
17 Claims
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1. A thin-film semiconductor component comprising:
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a carrier layer, wherein the carrier layer is a film; a layer stack arranged on the carrier layer, the layer stack containing a semiconductor material and configured to emit radiation; and a heat dissipating layer configured to cool the thin-film semiconductor component and applied on the carrier layer, the heat dissipating layer being arranged between the carrier layer and the layer stack, wherein the thin-film semiconductor component is free of a growth substrate used for growing the layer stack, wherein the heat-dissipating layer is embodied as a closed area, wherein side edges bounding the closed area run in curved fashion, wherein the heat-dissipating layer comprises an indented side edge and a bulgy side edge opposite to the indented side edge, and wherein the layer stack is arranged at the indented side edge. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification