Flexible circuit electrode array for improved layer adhesion
First Claim
Patent Images
1. A flexible circuit electrode array comprising:
- a base polymer layer;
a conductive trace deposited on the base polymer layer;
a top polymer layer deposited on the base polymer layer and the trace, and defining a void, wherein at least a portion of the top polymer layer directly contacts the base polymer layer;
the trace forming an annular-shaped electrode base extending peripherally, between the base polymer layer and the top polymer layer, around and beyond the void; and
an electrode connected to the electrode base through the void and extending peripherally in an annular-shaped portion beyond the void.
4 Assignments
0 Petitions
Accused Products
Abstract
The present invention is a flexible circuit electrode array for improved layer adhesions where the metal conductors overlap the polymer insulator. The steps to build the flexible circuit are as follows. Deposit a base polymer layer. Deposit a conductive trace over the base polymer layer. Deposit a top polymer layer over the trace and prepare a void in the top polymer layer smaller than the surface of the trace. Deposit an electrode on the trace through the void with a periphery larger than, and overlapping the void.
-
Citations
16 Claims
-
1. A flexible circuit electrode array comprising:
-
a base polymer layer; a conductive trace deposited on the base polymer layer; a top polymer layer deposited on the base polymer layer and the trace, and defining a void, wherein at least a portion of the top polymer layer directly contacts the base polymer layer; the trace forming an annular-shaped electrode base extending peripherally, between the base polymer layer and the top polymer layer, around and beyond the void; and an electrode connected to the electrode base through the void and extending peripherally in an annular-shaped portion beyond the void. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
-
Specification