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Routing method for flip chip package and apparatus using the same

  • US 8,875,083 B2
  • Filed: 10/03/2013
  • Issued: 10/28/2014
  • Est. Priority Date: 10/30/2009
  • Status: Active Grant
First Claim
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1. A routing method for a flip-chip package including a flip chip having outer pads and inner pads, the routing method comprising:

  • setting several pad arrays based on an arrangement order of the outer pads and the inner pads of the flip chip;

    establishing, with a computer, a routing path sequentially from an innermost pad array toward outer pad arrays, wherein establishing the routing path comprises;

    establishing a virtual ring including virtual pads based on a current pad array of the several pad arrays and a pad array directly above; and

    establishing chords on the virtual ring based on a maximum planar subset of chords and connection relationships between the virtual pads on the virtual ring; and

    selecting the routing path configured to provide a most direct connection between each pad array and the pad array directly above.

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