Light-mixing multichip package structure

• US 8,876,334 B2
• Filed: 01/16/2012
• Issued: 11/04/2014
• Est. Priority Date: 01/16/2012
• Status: Active Grant

• Current Assignee: Paragon Semiconductor Lighting Technology Co., Ltd.
• Original Assignee: Paragon Semiconductor Lighting Technology Co., Ltd.
• Inventors: Chung, Chia-Tin, Tai, Shih-Neng
• Primary Examiner(s): Patel, Ashok
• Application Number:
  US13/350,968
• Publication Number:
  US 20130181601A1
• Time in Patent Office: 1,023 Days
• US Class Current: 362/294
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a package unit, and a frame unit. The substrate unit includes a substrate body. The light-emitting unit includes a plurality of first and second light-emitting groups. The first and the second light-emitting groups are disposed on the substrate body and electrically connected to the substrate body in series. Each first light-emitting group includes a plurality of first parallel connection units electrically connected in parallel, and each first parallel connection unit includes at least one blue LED chip, and each second light-emitting group includes at least one red LED chip. The package unit includes a phosphor resin body disposed on the substrate body to cover the first and the second light-emitting groups. The frame unit includes a surrounding light-reflecting frame surrounding the first and the second light-emitting groups and the phosphor resin body.

Claims

1. A light-mixing multichip package structure, comprising:

a substrate unit including a substrate body;

a light-emitting unit including a plurality of first light-emitting groups and a plurality of second light-emitting groups, wherein the first light-emitting groups and the second light-emitting groups are disposed on the substrate body and electrically connected to the substrate body in series, each first light-emitting group includes a plurality of first parallel connection units electrically connected in parallel, and each first parallel connection unit includes at least one blue LED chip, and each second light-emitting group includes at least one red LED chip;

a package unit including a phosphor resin body disposed on the substrate body to cover the first light-emitting groups and the second light-emitting groups; and

a frame unit including a surrounding light-reflecting frame surrounding the first light-emitting groups, the second light-emitting groups, and the phosphor resin body, wherein the phosphor resin body contacts the surrounding light-reflecting frame.

2. The light-mixing multichip package structure of claim 1, wherein the first light-emitting groups and the second light-emitting groups are electrically and alternatively connected to the substrate body in series, each first parallel connection unit has the same number of the blue LED chip, and the work current of each first light-emitting group is similar to the work current of each second light-emitting group.

3. The light-mixing multichip package structure of claim 1, wherein the surrounding light-reflecting frame has a convex junction portion or a concave junction portion, the surrounding light-reflecting frame has an arc shape formed thereon, the surrounding light-reflecting frame has a radius tangent and the angle of the radius tangent relative to the top surface of the substrate body is between 40°

and 50°

, the maximum height of the surrounding light-reflecting frame relative to the top surface of the substrate body is between 0.3 mm and 0.7 mm, the width of the bottom side of the surrounding light-reflecting frame is between 1.5 mm and 3 mm, the thixotropic index of the surrounding light-reflecting frame is between 4 and 6, and the surrounding light-reflecting frame is formed by mixing inorganic additive with white thermohardening colloid.

4. The light-mixing multichip package structure of claim 1, wherein the substrate unit includes a plurality of positive pads disposed on the top surface of the substrate body and a plurality of negative pads disposed on the top surface of the substrate body, wherein each blue LED chip has a positive electrode and a negative electrode, the positive electrode of each blue LED chip corresponds to at least two of the positive pads, and the negative electrode of each blue LED chip corresponds to at least two of the negative pads, wherein each red LED chip has a positive electrode and a negative electrode, the positive electrode of each red LED chip corresponds to at least two of the positive pads, and the negative electrode of each red LED chip corresponds to at least two of the negative pads.

5. The light-mixing multichip package structure of claim 4, further comprising:

a conductive wire unit including a plurality of first conductive wires and a plurality of second conductive wires, wherein the positive electrode of each blue LED chip is electrically connected with one of the two corresponding positive pads by the second conductive wire, and the negative electrode of each blue LED chip is electrically connected with one of the two corresponding negative pads by the second conductive wire, wherein the positive electrode of each red LED chip is electrically connected with one of the two corresponding positive pads by the first conductive wire, and the negative electrode of each red LED chip is electrically connected with one of the two corresponding negative pads by the first conductive wire.

6. The light-mixing multichip package structure of claim 1, further comprising:

a current-limiting unit including at least one current-limiting chip disposed on the substrate body and electrically connected between the light-emitting unit and a constant voltage power source, wherein the at least one current-limiting chip is covered by an opaque package resin body, and the at least one current-limiting chip and the opaque package resin body are surrounded by a surrounding opaque frame.

7. The light-mixing multichip package structure of claim 1, further comprising:

a current-limiting unit and a rectifier unit, wherein the current-limiting unit includes at least one current-limiting chip disposed on the substrate body, the rectifier unit includes at least one bridge rectifier disposed on the substrate body, the at least one current-limiting chip is electrically connected between the light-emitting unit and the at least one bridge rectifier, the at least one bridge rectifier is electrically connected between the at least one current-limiting chip and an alternating current power source, the at least one current-limiting chip is covered by an opaque package resin body, and the at least one current-limiting chip and the opaque package resin body are surrounded by a surrounding opaque frame.

8. A light-mixing multichip package structure, comprising:

a substrate unit including a substrate body;

a light-emitting unit including a plurality of first light-emitting groups and a plurality of second light-emitting groups, wherein the first light-emitting groups and the second light-emitting groups are disposed on the substrate body and electrically connected to the substrate body in series, each first light-emitting group includes at least one blue LED chip, each second light-emitting group includes a plurality of second parallel connection units electrically connected in parallel, and each second parallel connection unit includes at least one red LED chip;

a package unit including a phosphor resin body disposed on the substrate body to cover the first light-emitting groups and the second light-emitting groups; and

a frame unit including a surrounding light-reflecting frame surrounding the first light-emitting groups, the second light-emitting groups, and the phosphor resin body, wherein the phosphor resin body contacts the surrounding light-reflecting frame.

9. The light-mixing multichip package structure of claim 8, wherein the first light-emitting groups and the second light-emitting groups are electrically and alternatively connected to the substrate body in series, each second parallel connection unit has the same number of the red LED chip, and the work current of each first light-emitting group is similar to the work current of each second light-emitting group.

10. The light-mixing multichip package structure of claim 8, wherein the surrounding light-reflecting frame has a convex junction portion or a concave junction portion, the surrounding light-reflecting frame has an arc shape formed thereon, the surrounding light-reflecting frame has a radius tangent and the angle of the radius tangent relative to the top surface of the substrate body is between 40°

and 50°

, the maximum height of the surrounding light-reflecting frame relative to the top surface of the substrate body is between 0.3 mm and 0.7 mm, the width of the bottom side of the surrounding light-reflecting frame is between 1.5 mm and 3 mm, the thixotropic index of the surrounding light-reflecting frame is between 4 and 6, and the surrounding light-reflecting frame is formed by mixing inorganic additive with white thermohardening colloid.

11. The light-mixing multichip package structure of claim 8, wherein the substrate unit includes a plurality of positive pads disposed on the top surface of the substrate body and a plurality of negative pads disposed on the top surface of the substrate body, wherein each blue LED chip has a positive electrode and a negative electrode, the positive electrode of each blue LED chip corresponds to at least two of the positive pads, and the negative electrode of each blue LED chip corresponds to at least two of the negative pads, wherein each red LED chip has a positive electrode and a negative electrode, the positive electrode of each red LED chip corresponds to at least two of the positive pads, and the negative electrode of each red LED chip corresponds to at least two of the negative pads.

12. The light-mixing multichip package structure of claim 11, further comprising:

a conductive wire unit including a plurality of first conductive wires and a plurality of second conductive wires, wherein the positive electrode of each blue LED chip is electrically connected with one of the two corresponding positive pads by the second conductive wire, and the negative electrode of each blue LED chip is electrically connected with one of the two corresponding negative pads by the second conductive wire, wherein the positive electrode of each red LED chip is electrically connected with one of the two corresponding positive pads by the first conductive wire, and the negative electrode of each red LED chip is electrically connected with one of the two corresponding negative pads by the first conductive wire.

13. The light-mixing multichip package structure of claim 8, further comprising:

a current-limiting unit including at least one current-limiting chip disposed on the substrate body and electrically connected between the light-emitting unit and a constant voltage power source, wherein the at least one current-limiting chip is covered by an opaque package resin body, and the at least one current-limiting chip and the opaque package resin body are surrounded by a surrounding opaque frame.

14. The light-mixing multichip package structure of claim 8, further comprising:

a current-limiting unit and a rectifier unit, wherein the current-limiting unit includes at least one current-limiting chip disposed on the substrate body, the rectifier unit includes at least one bridge rectifier disposed on the substrate body, the at least one current-limiting chip is electrically connected between the light-emitting unit and the at least one bridge rectifier, the at least one bridge rectifier is electrically connected between the at least one current-limiting chip and an alternating current power source, the at least one current-limiting chip is covered by an opaque package resin body, and the at least one current-limiting chip and the opaque package resin body are surrounded by a surrounding opaque frame.

15. A light-mixing multichip package structure, comprising:

a substrate unit including a substrate body;

a light-emitting unit including a plurality of first light-emitting groups and a plurality of second light-emitting groups, wherein the first light-emitting groups and the second light-emitting groups are disposed on the substrate body and electrically connected to the substrate body in series, wherein each first light-emitting group includes a plurality of first parallel connection units electrically connected in parallel, and each first parallel connection unit includes at least one blue LED chip, wherein each second light-emitting group includes a plurality of second parallel connection units electrically connected in parallel, and each second parallel connection unit includes at least one red LED chip;

a package unit including a phosphor resin body disposed on the substrate body to cover the first light-emitting groups and the second light-emitting groups; and

a frame unit including a surrounding light-reflecting frame surrounding the first light-emitting groups, the second light-emitting groups, and the phosphor resin body, wherein the phosphor resin body contacts the surrounding light-reflecting frame.

16. The light-mixing multichip package structure of claim 15, wherein the first light-emitting groups and the second light-emitting groups are electrically and alternatively connected to the substrate body in series, each first parallel connection unit has the same number of the blue LED chip, each second parallel connection unit has the same number of the red LED chip, and the work current of each first light-emitting group is similar to the work current of each second light-emitting group.

17. The light-mixing multichip package structure of claim 15, wherein the surrounding light-reflecting frame has a convex junction portion or a concave junction portion, the surrounding light-reflecting frame has an arc shape formed thereon, the surrounding light-reflecting frame has a radius tangent and the angle of the radius tangent relative to the top surface of the substrate body is between 40°

and 50°

, the maximum height of the surrounding light-reflecting frame relative to the top surface of the substrate body is between 0.3 mm and 0.7 mm, the width of the bottom side of the surrounding light-reflecting frame is between 1.5 mm and 3 mm, the thixotropic index of the surrounding light-reflecting frame is between 4 and 6, and the surrounding light-reflecting frame is formed by mixing inorganic additive with white thermohardening colloid.

18. The light-mixing multichip package structure of claim 15, wherein the substrate unit includes a plurality of positive pads disposed on the top surface of the substrate body and a plurality of negative pads disposed on the top surface of the substrate body, wherein each blue LED chip has a positive electrode and a negative electrode, the positive electrode of each blue LED chip corresponds to at least two of the positive pads, and the negative electrode of each blue LED chip corresponds to at least two of the negative pads, wherein each red LED chip has a positive electrode and a negative electrode, the positive electrode of each red LED chip corresponds to at least two of the positive pads, and the negative electrode of each red LED chip corresponds to at least two of the negative pads.

19. The light-mixing multichip package structure of claim 18, further comprising:

a conductive wire unit including a plurality of first conductive wires and a plurality of second conductive wires, wherein the positive electrode of each blue LED chip is electrically connected with one of the two corresponding positive pads by the second conductive wire, and the negative electrode of each blue LED chip is electrically connected with one of the two corresponding negative pads by the second conductive wire, wherein the positive electrode of each red LED chip is electrically connected with one of the two corresponding positive pads by the first conductive wire, and the negative electrode of each red LED chip is electrically connected with one of the two corresponding negative pads by the first conductive wire.

20. The light-mixing multichip package structure of claim 15, further comprising:

a current-limiting unit including at least one current-limiting chip disposed on the substrate body and electrically connected between the light-emitting unit and a constant voltage power source, wherein the at least one current-limiting chip is covered by an opaque package resin body, and the at least one current-limiting chip and the opaque package resin body are surrounded by a surrounding opaque frame.

21. The light-mixing multichip package structure of claim 15, further comprising:

a current-limiting unit and a rectifier unit, wherein the current-limiting unit includes at least one current-limiting chip disposed on the substrate body, the rectifier unit includes at least one bridge rectifier disposed on the substrate body, the at least one current-limiting chip is electrically connected between the light-emitting unit and the at least one bridge rectifier, the at least one bridge rectifier is electrically connected between the at least one current-limiting chip and an alternating current power source, the at least one current-limiting chip is covered by an opaque package resin body, and the at least one current-limiting chip and the opaque package resin body are surrounded by a surrounding opaque frame.