Method of manufacturing a light emitting, power generating or other electronic apparatus
First Claim
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1. A method of fabricating an electronic device, the method comprising:
- depositing a plurality of diodes suspended in a mixture of a first solvent and a viscosity modifier, each diode of the plurality of diodes comprising;
a light emitting or absorbing region, the light emitting or absorbing region having a mesa region;
at least one first terminal coupled to the light emitting or absorbing region on a first side and located peripherally to the mesa region; and
a second terminal coupled centrally to the mesa region on the first side;
wherein the diode has a lateral dimension less than about 50 microns and a height less than about 25 microns; and
depositing one or more first conductors.
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Abstract
An exemplary printable composition of a liquid or gel suspension of diodes comprises a plurality of diodes, a first solvent and/or a viscosity modifier. An exemplary method of fabricating an electronic device comprises: depositing one or more first conductors; and depositing a plurality of diodes suspended in a mixture of a first solvent and a viscosity modifier. Various exemplary diodes have a lateral dimension between about 10 to 50 microns and about 5 to 25 microns in height. Other embodiments may also include a plurality of substantially chemically inert particles having a range of sizes between about 10 to about 50 microns.
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Citations
78 Claims
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1. A method of fabricating an electronic device, the method comprising:
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depositing a plurality of diodes suspended in a mixture of a first solvent and a viscosity modifier, each diode of the plurality of diodes comprising; a light emitting or absorbing region, the light emitting or absorbing region having a mesa region; at least one first terminal coupled to the light emitting or absorbing region on a first side and located peripherally to the mesa region; and a second terminal coupled centrally to the mesa region on the first side; wherein the diode has a lateral dimension less than about 50 microns and a height less than about 25 microns; and depositing one or more first conductors. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57)
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58. A method comprising:
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depositing a plurality of diodes suspended in a mixture of first solvent and a viscosity modifier on a first side of an optically transmissive base, each diode of the plurality of diodes comprising; a light emitting or absorbing region, the light emitting or absorbing region having a mesa region; at least one first terminal coupled to the light emitting or absorbing region on a first side and located peripherally to the mesa region; and a second terminal coupled centrally to the mesa region on the first side; wherein the diode has a lateral dimension less than about 50 microns and a height less than about 25 microns; depositing one or more first conductors coupled to the at least one first terminals; depositing at least one dielectric layer coupled to the one or more first conductors; depositing one or more second conductors coupled to the second terminals; and depositing a first phosphor layer on a second side of the optically transmissive base. - View Dependent Claims (59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71)
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72. A method of fabricating an electronic device, the method comprising:
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depositing a plurality of diodes, each diode of the plurality of diodes comprising; a light emitting or absorbing region, the light emitting or absorbing region having a mesa region; at least one first terminal coupled to the light emitting or absorbing region on a first side and located peripherally to the mesa region; and a second terminal coupled centrally to the mesa region on the first side; wherein the diode has a lateral dimension less than about 50 microns and a height less than about 25 microns. - View Dependent Claims (73, 74, 75, 76, 77, 78)
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Specification