Producing method of light emitting element transfer sheet, producing method of light emitting device, light emitting element transfer sheet, and light emitting device

• US 8,877,528 B2
• Filed: 04/13/2012
• Issued: 11/04/2014
• Est. Priority Date: 04/14/2011
• Status: Expired due to Fees

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: Ooyabu, Yasunari, Naito, Toshiki, Sato, Satoshi
• Primary Examiner(s): Payen, Marvin
• Assistant Examiner(s): BARZYKIN, VICTOR V
• Application Number:
  US13/446,611
• Publication Number:
  US 20120261681A1
• Time in Patent Office: 935 Days
• Field of Search: 257/98, 257/88, 257/E33.061, 257/E33.072, 438/27, 438/33, 359/838
• US Class Current: 438/27
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

A method for producing a light emitting transfer sheet includes the steps of preparing a light emitting element sheet including a light semiconductor layer connected to an electrode portion on one side surface and a phosphor layer laminated on the other side surface; dividing the light emitting element sheet into plural pieces to form a plurality of light emitting elements; disposing a plurality of the light emitting elements on a substrate to be spaced apart from each other; forming a reflecting resin layer containing a light reflecting component on the substrate so as to cover the light emitting elements; and removing the reflecting resin layer partially so that one side surface of the electrode portion is exposed from the reflecting resin layer.

Claims

1. A method for producing a light emitting element transfer sheet comprising:

a first step of preparing a light emitting element sheet including a light semiconductor layer connected to an electrode portion on one side surface in a thickness direction thereof and a phosphor layer laminated on the other side surface in the thickness direction of the light semiconductor layer so as to be in contact with the other side surface;

a second step of dividing the light emitting element sheet into plural pieces to form a plurality of light emitting elements, each of which includes the electrode portion, the light semiconductor layer, and the phosphor layer after the first step;

a third step of disposing a plurality of the light emitting elements on a release substrate to be spaced apart from each other so that the phosphor layer is in contact with the release substrate after the second step;

a fourth step of forming a reflecting resin layer containing a light reflecting component on the release substrate so as to cover the light emitting elements after the third step; and

a fifth step of removing the reflecting resin layer partially so that one side surface in the thickness direction of the electrode portion is exposed from the reflecting resin layer after the fourth step.

2. A method for producing a light emitting device comprising the steps of:

producing a light emitting element transfer sheet by a method for producing a light emitting element transfer sheet including;

a first step of preparing a light emitting element sheet including a light semiconductor layer connected to an electrode portion on one side surface in a thickness direction thereof and a phosphor layer laminated on the other side surface in the thickness direction of the light semiconductor layer so as to be in contact with the other side surface;

a second step of dividing the light emitting element sheet into plural pieces to form a plurality of light emitting elements, each of which includes the electrode portion, the light semiconductor layer, and the phosphor layer after the first step;

a third step of disposing a plurality of the light emitting elements on a release substrate to be spaced apart from each other so that the phosphor layer is in contact with the release substrate after the second step;

a fourth step of forming a reflecting resin layer containing a light reflecting component on the release substrate so as to cover the light emitting elements after the third step; and

a fifth step of removing the reflecting resin layer partially so that one side surface in the thickness direction of the electrode portion is exposed from the reflecting resin layer after the fourth step,

dividing the light emitting element transfer sheet into a plurality of single pieces, each of which includes at least one piece of the light emitting element;

allowing the single piece to be disposed in opposed relation to a base board including a terminal in a thickness direction, and the electrode portion to be electrically connected to the terminal, so that the light emitting element is flip-chip mounted on the base board, and

releasing the release substrate from the single piece.

3. A light emitting element transfer sheet comprising:

a release substrate;

a plurality of light emitting elements including a light semiconductor layer, an electrode portion connected to one side surface in a thickness direction of the light semiconductor layer, and a phosphor layer laminated on the other side surface in the thickness direction of the light semiconductor layer so as to be in contact with the other side surface, and disposed on the release substrate to be spaced apart from each other so that the phosphor layer is in contact with the release substrate; and

a reflecting resin layer containing a light reflecting component and on the release substrate, covering the light emitting elements and exposing one side surface in the thickness direction of the electrode portion.

4. A light emitting device comprising:

a single piece obtained by dividing a light emitting element transfer sheet, including

a release substrate;

a plurality of light emitting elements including a light semiconductor layer, an electrode portion connected to one side surface in a thickness direction of the light semiconductor layer, and a phosphor layer laminated on the other side surface in the thickness direction of the light semiconductor layer so as to be in contact with the other side surface, and disposed on the release substrate to be spaced apart from each other so that the phosphor layer is in contact with the release substrate; and

a reflecting resin layer containing a light reflecting component and on the release substrate, covering the light emitting elements and exposing one side surface in the thickness direction of the electrode portion,

into plural pieces, including at least one piece of a light emitting element, to be disposed in opposed relation to a base board including a terminal in a thickness direction, and an electrode portion to be electrically connected to the terminal, so that the light emitting element is flip-chip mounted on the base board.