Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method
First Claim
1. A method of fabricating a substrate core structure comprising:
- providing a starting insulating layer;
forming an initial conductive layer on said starting insulating layer;
laser drilling a first set of via openings through the starting insulating layer without laser drilling through said conductive layer such that said first set of via openings extend to said first conductive layer;
filling the first set of via openings with a conductive material to provide a first set of conductive vias;
after filling the first set of via openings, providing a first patterned conductive layer on one side of the starting insulating layer, and a second patterned conductive layer on another side of the starting insulating layer, the first set of conductive vias contacting the first patterned conductive layer at one side thereof, and the second patterned conductive layer at another side thereof;
providing a first supplemental insulating layer onto the first patterned conductive layer and a second supplemental insulating layer on the second patterned conductive layer;
laser drilling a second set of via openings through the first supplemental insulating layer, the via openings of the second set extending to the first patterned conductive layer and laser drilling a third set of via openings through the second supplemental insulating layer, the third set of via openings extending to the second patterned conductive layer;
filling the second set of via openings with a conductive material to provide a second set of conductive vias and filling the third set of via openings with a conductive material to form a third set of conductive vias;
providing a first supplemental patterned conductive layer onto an exposed side of the first supplemental insulating layer, the second set of conductive vias contacting the first patterned conductive layer at one side thereof and the first supplemental patterned conductive layer at another side thereof; and
providing a second supplemental patterned conductive layer on the exposed side of the second supplemental insulating layer, the third set of conductive vias contacting the second patterned conductive layer at one side thereof and the second supplemental patterned conductive layer at another side thereof.
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Accused Products
Abstract
A method of fabricating a substrate core structure, and a substrate core structure formed according to the method. The method includes: laser drilling a first set of via openings through a starting insulating layer; filling the first set of via openings with a conductive material to provide a first set of conductive vias; providing first and second patterned conductive layers on opposite sides of the starting insulating layer; providing a supplemental insulating layer onto the first patterned conductive layer; laser drilling a second set of via openings through the supplemental insulating layer; filling the second set of via openings with a conductive material to provide a second set of conductive vias; and providing a supplemental patterned conductive layer onto an exposed side of the supplemental insulating layer, the second set of conductive vias contacting the first patterned conductive layer and the supplemental patterned conductive layer at opposite sides thereof.
64 Citations
13 Claims
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1. A method of fabricating a substrate core structure comprising:
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providing a starting insulating layer; forming an initial conductive layer on said starting insulating layer; laser drilling a first set of via openings through the starting insulating layer without laser drilling through said conductive layer such that said first set of via openings extend to said first conductive layer; filling the first set of via openings with a conductive material to provide a first set of conductive vias; after filling the first set of via openings, providing a first patterned conductive layer on one side of the starting insulating layer, and a second patterned conductive layer on another side of the starting insulating layer, the first set of conductive vias contacting the first patterned conductive layer at one side thereof, and the second patterned conductive layer at another side thereof; providing a first supplemental insulating layer onto the first patterned conductive layer and a second supplemental insulating layer on the second patterned conductive layer; laser drilling a second set of via openings through the first supplemental insulating layer, the via openings of the second set extending to the first patterned conductive layer and laser drilling a third set of via openings through the second supplemental insulating layer, the third set of via openings extending to the second patterned conductive layer; filling the second set of via openings with a conductive material to provide a second set of conductive vias and filling the third set of via openings with a conductive material to form a third set of conductive vias; providing a first supplemental patterned conductive layer onto an exposed side of the first supplemental insulating layer, the second set of conductive vias contacting the first patterned conductive layer at one side thereof and the first supplemental patterned conductive layer at another side thereof; and providing a second supplemental patterned conductive layer on the exposed side of the second supplemental insulating layer, the third set of conductive vias contacting the second patterned conductive layer at one side thereof and the second supplemental patterned conductive layer at another side thereof. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification