Method of depositing organic layers onto a substrate
First Claim
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1. A method for depositing one or more organic layers onto a substrate, comprising:
- transferring the one or more organic layers from a depositing surface of a stamp to the substrate by bringing the layer coated depositing surface of the stamp into contact with the substrate; and
the step of contacting the one or more organic layers with a plasticizer, wherein the plasticizer is deposited on the surface of the substrate on which the organic layer is to be transferred prior to transferring the one or more organic layers from a depositing surface of a stamp to the substrate.
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Abstract
A method for depositing one or more organic layers onto a substrate, which includes: transferring the one or more layers from a depositing surface of a stamp to the substrate by bringing the layer coated depositing surface of the stamp into contact with the substrate, and the use of either or both of the steps of: (i) contacting the polymer with a plasticizer; and (ii) heating the substrate and/or stamp, in order to create favorable conditions for conformal contact and uniform layer transfer.
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Citations
47 Claims
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1. A method for depositing one or more organic layers onto a substrate, comprising:
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transferring the one or more organic layers from a depositing surface of a stamp to the substrate by bringing the layer coated depositing surface of the stamp into contact with the substrate; and the step of contacting the one or more organic layers with a plasticizer, wherein the plasticizer is deposited on the surface of the substrate on which the organic layer is to be transferred prior to transferring the one or more organic layers from a depositing surface of a stamp to the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45)
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46. A method for depositing one or more organic layers onto a substrate, comprising:
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depositing a plasticizer onto a surface of the substrate; if the plasticizer deposited on the substrate contains a solvent, heating the substrate sufficiently to remove any solvent without damaging the plasticizer; depositing the one or more organic layers onto a depositing surface of a stamp; transferring the one or more organic layers from the depositing surface of the stamp to the surface of the substrate on which the plasticizer was deposited by bringing the depositing surface of the stamp having the one or more organic layers deposited thereupon into contact with the surface of the substrate on which the plasticizer was deposited; heating the substrate and/or the stamp to create facilitate conformal contact and uniform transfer of the one or more organic layers from the depositing surface of the stamp to the substrate; and removing the stamp from the substrate leaving the one or more organic layers attached to the substrate.
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47. A method for depositing one or more organic layers onto a substrate, comprising:
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depositing a plasticizer onto a surface of the substrate; if the plasticizer deposited on the substrate contains a solvent, heating the substrate sufficiently to remove any solvent without damaging the plasticizer; preparing a depositing surface of a patterned stamp for deposition of the one or more organic layers thereupon; depositing the one or more organic layers onto the depositing surface of the stamp; removing unneeded sections of the one or more organic layers from the depositing surface of the stamp and discarding the same; transferring the one or more organic layers from the depositing surface of the stamp to the surface of the substrate on which the plasticizer was deposited by bringing the depositing surface of the stamp having the one or more organic layers deposited thereupon into contact with the surface of the substrate on which the plasticizer was deposited; heating the substrate and/or the stamp to create facilitate conformal contact and uniform transfer of the one or more organic layers from the depositing surface of the stamp to the substrate; and removing the stamp from the substrate leaving the one or more organic layers attached to the substrate.
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Specification