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LED package with efficient, isolated thermal path

  • US 8,878,217 B2
  • Filed: 09/14/2012
  • Issued: 11/04/2014
  • Est. Priority Date: 06/28/2010
  • Status: Active Grant
First Claim
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1. A method of forming a low-cost light emitting diode (LED) package, comprising:

  • providing a body, comprising;

    at least a portion of a thermal element and at least a portion of an electrical element both embedded within the body and extending directly from a bottom surface of the body, the thermal element being electrically isolated from the electrical element; and

    at least one light emitter device thermally connected to the thermal element and electrically connected to the electrical element; and

    terminating the thermal element and the electrical element to form exposed portions substantially flush with opposing lateral sides of the body.

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