Compact three dimensional vertical NAND and method of making thereof
First Claim
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1. A NAND device, comprising:
- an array of vertical NAND strings, wherein;
each NAND string comprises a semiconductor channel, a tunnel dielectric located adjacent to the semiconductor channel, a charge storage region located adjacent to the tunnel dielectric, and a blocking dielectric located adjacent to the charge storage region;
at least one end portion of the semiconductor channel extending substantially perpendicular to a major surface of a substrate; and
the array comprises at least a 3×
3 array of NAND strings;
a plurality of control gate electrodes having a mesh shape extending substantially parallel to the major surface of the substrate, wherein the plurality of control gate electrodes comprise at least a first control gate electrode located in a first device level and a second control gate electrode located in a second device level located over the major surface of the substrate and below the first device level, wherein;
the first control gate electrode and the second control gate electrode are continuous in the array.
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Abstract
A NAND device has at least a 3×3 array of vertical NAND strings in which the control gate electrodes are continuous in the array and do not have an air gap or a dielectric filled trench in the array. The NAND device is formed by first forming a lower select gate level having separated lower select gates, then forming plural memory device levels containing a plurality of NAND string portions, and then forming an upper select gate level over the memory device levels having separated upper select gates.
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Citations
24 Claims
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1. A NAND device, comprising:
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an array of vertical NAND strings, wherein; each NAND string comprises a semiconductor channel, a tunnel dielectric located adjacent to the semiconductor channel, a charge storage region located adjacent to the tunnel dielectric, and a blocking dielectric located adjacent to the charge storage region; at least one end portion of the semiconductor channel extending substantially perpendicular to a major surface of a substrate; and the array comprises at least a 3×
3 array of NAND strings;a plurality of control gate electrodes having a mesh shape extending substantially parallel to the major surface of the substrate, wherein the plurality of control gate electrodes comprise at least a first control gate electrode located in a first device level and a second control gate electrode located in a second device level located over the major surface of the substrate and below the first device level, wherein; the first control gate electrode and the second control gate electrode are continuous in the array. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A NAND device, comprising:
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an array of vertical NAND strings, wherein; each NAND string comprises a semiconductor channel, a tunnel dielectric located adjacent to the semiconductor channel, a charge storage region located adjacent to the tunnel dielectric, and a blocking dielectric located adjacent to the charge storage region; at least one end portion of the semiconductor channel extending substantially perpendicular to a major surface of a substrate; and the array comprises at least a 3×
3 array of NAND strings;a plurality of control gate electrodes having a mesh shape extending substantially parallel to the major surface of the substrate, wherein the plurality of control gate electrodes comprise at least a first control gate electrode located in a first device level and a second control gate electrode located in a second device level located over the major surface of the substrate and below the first device level, wherein; the first control gate electrode and the second control gate electrode do not have an air gap or a dielectric filled trench in the array. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification