Antenna-module hybrid circuit
First Claim
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1. A hybrid circuit with an integral antenna module, comprising:
- an electronic circuit comprising circuit elements incorporated on a substrate below the circuit elements; and
an antenna module comprising;
a dielectric material;
wherein the dielectric material alone is continuously shaped to form a void that encapsulates all the circuit elements of the electronic circuit;
a single conducting plate on one side of the dielectric materiala ground plate on the other side of the dielectric material facing the void above the circuit elements to provide a protective shield for the antenna from the circuit elements; and
wherein the dielectric material extends outward beyond the ground plate reaching down to the substrate below the circuit elements forming the void and encapsulating the circuit elements.
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Abstract
A hybrid circuit with an integral antenna module, including an electronic circuit that includes circuit elements; and an antenna module including a dielectric material shaped to form a void enclosed by the dielectric material, a conducting patch on one side of the dielectric material. Wherein the circuit elements are enclosed by the dielectric material, so that the elements of the circuit are positioned inside the void formed by the dielectric material.
9 Citations
10 Claims
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1. A hybrid circuit with an integral antenna module, comprising:
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an electronic circuit comprising circuit elements incorporated on a substrate below the circuit elements; and an antenna module comprising; a dielectric material;
wherein the dielectric material alone is continuously shaped to form a void that encapsulates all the circuit elements of the electronic circuit;a single conducting plate on one side of the dielectric material a ground plate on the other side of the dielectric material facing the void above the circuit elements to provide a protective shield for the antenna from the circuit elements; and wherein the dielectric material extends outward beyond the ground plate reaching down to the substrate below the circuit elements forming the void and encapsulating the circuit elements. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification