Touch screen panel display
First Claim
1. A touch screen panel display device, the device comprising:
- a Y-touch sensor bonding pattern having a bonding portion bonded to a touch screen Flexible Printed Circuit Board (FPCB);
an X-touch sensor bonding pattern having a bonding portion bonded to the touch screen FPCB, the bonding portion of the X-touch sensor bonding pattern being positioned toward the touch screen FPCB further than the bonding portion of the Y-touch sensor bonding pattern; and
the touch screen FPCB having an X-contact point portion contacting the bonding portion of the X-touch sensor bonding pattern and a Y-contact point portion contacting the bonding portion of the Y-touch sensor bonding pattern.
1 Assignment
0 Petitions
Accused Products
Abstract
A touch screen panel display device is provided. The touch screen panel display device includes a Y-touch sensor bonding pattern having a bonding portion bonded to a touch screen Flexible Printed Circuit Board (FPCB), an X-touch sensor bonding pattern positioned toward the touch screen FPCB further than the bonding portion of the Y-touch sensor bonding pattern and having a bonding portion bonded to the touch screen FPCB, and a touch screen FPCB having an X-contact point portion contacting the bonding portion of the X-touch sensor bonding pattern and a Y-contact point portion contacting the bonding portion of the Y-touch sensor bonding pattern. Thereby, an Anisotropic Conducting Film (ACF) swelling failure occurring as a heat is again applied to a location at which bonding is already complete can be prevented.
6 Citations
10 Claims
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1. A touch screen panel display device, the device comprising:
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a Y-touch sensor bonding pattern having a bonding portion bonded to a touch screen Flexible Printed Circuit Board (FPCB); an X-touch sensor bonding pattern having a bonding portion bonded to the touch screen FPCB, the bonding portion of the X-touch sensor bonding pattern being positioned toward the touch screen FPCB further than the bonding portion of the Y-touch sensor bonding pattern; and the touch screen FPCB having an X-contact point portion contacting the bonding portion of the X-touch sensor bonding pattern and a Y-contact point portion contacting the bonding portion of the Y-touch sensor bonding pattern. - View Dependent Claims (2, 3)
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4. A touch screen panel display device, the device comprising:
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an X-touch sensor bonding pattern having a bonding portion bonded to a touch screen FPCB; a Y-touch sensor bonding pattern having a bonding portion bonded to the touch screen FPCB, the bonding portion of the Y-touch sensor bonding pattern being positioned toward the touch screen FPCB further than the bonding portion of the X-touch sensor bonding pattern; and the touch screen FPCB having an X-contact point portion contacting the bonding portion of the X-touch sensor bonding pattern and a Y-contact point portion contacting the bonding portion of the Y-touch sensor bonding pattern. - View Dependent Claims (5, 6)
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7. A touch screen panel display, the display comprising:
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a display unit for displaying an image; an Indium Tin Oxide (ITO) film arranged above the display unit; a protector for protecting the touch screen panel display from the outside; and a Flexible Printed Circuit Board (FPCB) arranged between the ITO film and the protector, wherein the protector includes a Y-touch sensor bonding pattern arranged at a lower surface of the protector and having a bonding portion for bonding to a Y-contact point portion of the FPCB, wherein the ITO film includes an X-touch sensor bonding pattern arranged at an upper surface of the ITO film and having a bonding portion for bonding to an X-contact point portion of the FPCB, and wherein the bonding portion of the Y-touch sensor bonding pattern is spaced apart from the bonding portion of the X-touch sensor bonding pattern such that a line perpendicular to the bonding portion of the Y-touch sensor bonding pattern and passing through the bonding portion of the Y-touch sensor bonding pattern does not intersect the bonding portion of the X-touch sensor bonding pattern. - View Dependent Claims (8, 9, 10)
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Specification