Acoustic apparatus and method of manufacturing

• US 8,879,767 B2
• Filed: 08/10/2012
• Issued: 11/04/2014
• Est. Priority Date: 08/19/2011
• Status: Expired due to Fees

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Wickstrom, Timothy K.
• Primary Examiner(s): Goins, Davetta W
• Assistant Examiner(s): ETESAM, AMIR HOSSEIN
• Application Number:
  US13/571,566
• Publication Number:
  US 20130156235A1
• Time in Patent Office: 816 Days
• Field of Search: 381/174, 381/175, 381/360, 381/361, 381/355, 381/369, 381/357
• US Class Current: 381/361
• CPC Class Codes: H04R 1/227 using transducers reproducing the same frequency band
• CPC Class Codes: H04R 1/2853 using an acoustic labyrinth or a transmission line
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2201/003 Mems transducers or their use
• CPC Class Codes: H04R 2499/11 Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182

Abstract

A microphone assembly comprising includes a base, at least one side wall, and a cover. The side wall is disposed on the base. The cover is coupled to the at least one side wall. The base, the side wall, and the cover form a cavity and the cavity has a MEMS device disposed therein. A top port extends through the cover and a first channel extends through the side wall. The first channel is arranged so as to communicate with the top port. A bottom port extends through the base. The MEMS device is disposed over the bottom port. A second channel is formed and extends along a bottom surface of the base. The second channel extends between and communicates with the first channel and the bottom port. Sound received by the top port is received at the MEMS device.

Claims

1. A microphone assembly comprising:

a base, the base having a bottom surface, the bottom surface being a single plane;

at least one side wall disposed on the base;

a cover coupled to the at least one side wall, wherein the base, the at least one side wall, and the cover form a cavity, the cavity having a MEMS device disposed therein;

a top port extending through the cover;

a first channel extending through the at least one side wall, the first channel arranged so as to communicate with the top port;

a bottom port extending through the base, wherein the MEMS device is disposed over the bottom port;

a second channel formed and extending along a bottom surface of the base, portions of the bottom surface of the base being exposed to the exterior of the assembly and not being in direct contact with the MEMS device, the second channel extending between and communicating with the first channel and the bottom port wherein the second channel is formed by a raised solder ring, the bottom surface of the base, and a mounting substrate, wherein the solder ring is disposed on the bottom surface, and wherein one side of the second channel is coextensive with the plane of the base and does not extend into the base;

such that sound energy received by the top port passes through the first channel, the second channel, and the bottom port and is received at the MEMS device.

2. The microphone assembly of claim 1 wherein the base comprises a printed circuit board.

3. The microphone assembly of claim 1 further comprising an integrated circuit disposed in the cavity and coupled to the MEMS device.

4. The microphone assembly of claim 1 wherein the MEMS device defines a front volume and a back volume and the back volume is significantly larger than the front volume.

5. A multiple microphone assembly comprising:

a base, the base having a bottom surface, the bottom surface being a single plane;

at least one side wall disposed on the base;

a cover coupled to the at least one side wall, wherein the base, the at least one wall, and the cover form a cavity, the cavity having a first MEMS device and a second MEMS device disposed therein;

a top port extending through the cover;

a first channel extending through the at least one side wall, the first channel arranged so as to communicate with the top port;

a first bottom port extending through the base, wherein the first MEMS device is disposed over the first bottom port;

a second channel formed and extending along a bottom surface of the base, portions of the bottom surface of the base being exposed to the exterior of the assembly and not being in direct contact with the MEMS device, the second channel extending between and communicating with the first channel and the first bottom port wherein the second channel is formed by a first raised solder ring, the bottom surface of the base, and a mounting substrate, wherein the first solder ring is disposed on the bottom surface, and wherein one side of the second channel is coextensive with the plane of the base and does not extend into the base;

a second bottom port extending through the base, wherein the second MEMS device is disposed over the second bottom port;

a third channel formed and extending along the bottom surface of the base, the third channel extending between and communicating with a fourth channel in a substrate and the second bottom port wherein the third channel is formed by a second raised solder ring, the bottom surface of the base, and a mounting substrate, wherein the second solder ring is disposed on the bottom surface, and wherein one side of the third channel is coextensive with the plane of the base and does not extend into the base;

such that first sound energy received by the top port passes through the first channel, the second channel, and the bottom port and is received at the first MEMS device; and

such that second sound energy received from the fourth channel in the substrate passes through the third channel and the second bottom port and is received at the second MEMS device.

6. The multiple microphone assembly of claim 5 wherein the first MEMS device and the second MEMS device share a single back volume.

7. The multiple microphone assembly of claim 5 further comprising an interior wall, the interior wall partitioning the cavity into a first sub-cavity and a second sub-cavity.

8. The multiple microphone assembly of claim 7 wherein the first MEMS device is disposed in the first sub-cavity and the second MEMS device is disposed in the second sub-cavity.

9. The multiple microphone assembly of claim 8 wherein the first MEMS device utilizes a first back volume and the second MEMS device utilizes a second back volume, and the first back volume is separated from the second back volume by the interior wall.

10. The multiple microphone assembly of claim 5 wherein the base comprises a printed circuit board.

11. The multiple microphone assembly of claim 5 further comprising an integrated circuit disposed in the cavity and coupled to the first MEMS device or the second MEMS device.

12. The multiple microphone assembly of claim 5:

wherein the first MEMS device and the second MEMS device form at least one front volume;

wherein the first MEMS device and the base form a first front volume;

wherein the second MEMS device and the base foam a second front volume; and

wherein the at least one back volume is significantly larger than the first front volume or the second front volume.