Charger assembly and electromagnetic interference shield assembly

• US 8,885,360 B2
• Filed: 11/30/2011
• Issued: 11/11/2014
• Est. Priority Date: 11/30/2011
• Status: Active Grant

• Current Assignee: Lear Corporation
• Original Assignee: Lear Corporation
• Inventors: Pavlovic, Slobodan, Sharaf, Nadir, Daftuar, Dilip
• Primary Examiner(s): Hoffberg, Robert J
• Assistant Examiner(s): PATEL, MUKUNDBHAI G
• Application Number:
  US13/307,942
• Publication Number:
  US 20130135841A1
• Time in Patent Office: 1,077 Days
• Field of Search: 361/818, 361/600, 361/816, 174/50, 174/386, 174/394, 252/500, 252512-514, 252/515.1, 439/607.02, 439/535
• US Class Current: 361/818
• CPC Class Codes: H05K 9/0047 being rigid plastic containers having conductive particles, fibres or mesh embedded therein

Abstract

An electromagnetic interference shield assembly is provided with a first housing formed of a first conductive polymer. The first housing has a cavity sized to receive an electronic sub-assembly therein. A second housing is formed of a second conductive polymer. The second housing has a cavity sized to receive the first housing therein.

Claims

1. An electronic assembly comprising:

a first housing formed of a first conductive polymer, the first housing having a cavity;

a second housing formed of a second conductive polymer, the second housing having a cavity sized to receive the first housing therein; and

an electronic subassembly disposed within the cavity of the first housing;

wherein the electronic subassembly comprises a high voltage charger to convert alternating current to direct current to charge an automotive battery;

wherein the first housing and the second housing provide an electromagnetic interference (EMI) shield assembly;

wherein the first housing is formed of polyamide 66 with ten percent Carbon Nickel fiber to shield against high frequency EMI;

wherein the second housing is formed of polyamide 66 with thirty percent Stainless Steel fiber to shield against low frequency EMI; and

wherein the EMI shield assembly further comprises a metallic layer disposed between the first housing and the second housing.

2. The electronic assembly of claim 1 wherein the metallic layer is coated upon one of an exterior of the first housing and an interior of the second housing.

3. The electronic assembly of claim 1 wherein the metallic layer is coated upon an exterior of the first housing.

4. The electronic assembly of claim 1 wherein the metallic layer comprises aluminum foil.

5. The electronic assembly of claim 1 wherein the metallic layer comprises a steel housing.

6. The electronic assembly of claim 1 wherein the first housing shields against EMI within a range of 20 Hertz to 1.73 MHertz.

7. The electronic assembly of claim 1 wherein the second housing shields against EMI within a range of twenty to one hundred Hertz.

8. The electronic assembly of claim 1 wherein the first housing has a wall thickness of approximately one millimeter.