Two degree of freedom dithering platform for MEMS sensor calibration
First Claim
1. A micro-electromechanical system (MEMS) sensing device, the device comprising:
- a MEMS sensor formed in a plane of a MEMS sensor layer; and
at least one rotator configured to dither the MEMS sensor, wherein dithering the MEMS sensor is performed in the plane of the MEMS sensor layer and about an axis in the plane of the MEMS sensor layer, wherein the at least one rotator comprises;
a first rotor layer, the first rotor layer comprising a first rotor portion connected to the MEMS sensor, wherein the first rotor portion rotates about the axis in the plane of the MEMS sensor layer; and
a second rotor layer, the second rotor layer comprising a second rotor portion connected to the MEMS sensor, wherein the second rotor portion rotates about the axis in the plane of the MEMS sensor layer.
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Accused Products
Abstract
Systems and methods for two degree of freedom dithering for micro-electro-mechanical system (MEMS) sensor calibration are provided. In one embodiment, a method for a device comprises forming a MEMS sensor layer, the MEMS sensor layer comprising a MEMS sensor and an in-plane rotator to rotate the MEMS sensor in the plane of the MEMS sensor layer. Further, the method comprises forming a first and second rotor layer and bonding the first rotor layer to a top surface and the second rotor layer to the bottom surface of the MEMS sensor layer, such that a first and second rotor portion of the first and second rotor layers connect to the MEMS sensor. Also, the method comprises separating the first and second rotor portions from the first and second rotor layers, wherein the first and second rotor portions and the MEMS sensor rotate about an in-plane axis of the MEMS sensor layer.
12 Citations
12 Claims
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1. A micro-electromechanical system (MEMS) sensing device, the device comprising:
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a MEMS sensor formed in a plane of a MEMS sensor layer; and at least one rotator configured to dither the MEMS sensor, wherein dithering the MEMS sensor is performed in the plane of the MEMS sensor layer and about an axis in the plane of the MEMS sensor layer, wherein the at least one rotator comprises; a first rotor layer, the first rotor layer comprising a first rotor portion connected to the MEMS sensor, wherein the first rotor portion rotates about the axis in the plane of the MEMS sensor layer; and a second rotor layer, the second rotor layer comprising a second rotor portion connected to the MEMS sensor, wherein the second rotor portion rotates about the axis in the plane of the MEMS sensor layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A micro-electromechanical system (MEMS) gyroscope, the MEMS gyroscope comprising:
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a MEMS gyroscope layer, the MEMS gyroscope layer comprising; a MEMS sensor; and a first in-plane rotator configured to rotate the MEMS sensor in the plane of the MEMS gyroscope layer; a first rotor layer bonded to the MEMS gyroscope layer, the first rotor layer comprising a first rotor portion connected to the MEMS sensor; and a second rotor layer bonded to the MEMS gyroscope layer, the second rotor layer comprising a second rotor portion connected to the MEMS sensor, wherein the first rotor portion, the second rotor portion, and the MEMS sensor rotate about an axis in the plane of the MEMS gyroscope layer. - View Dependent Claims (12)
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Specification