Method of manufacturing addressable and static electronic displays

• US 8,889,216 B2
• Filed: 05/31/2007
• Issued: 11/18/2014
• Est. Priority Date: 05/31/2007
• Status: Active Grant

• Current Assignee: NthDegree Technologies Worldwide Inc.
• Original Assignee: NthDegree Technologies Worldwide Inc.
• Inventors: Ray, William Johnstone, Lowenthal, Mark David
• Primary Examiner(s): VETERE, ROBERT A
• Application Number:
  US11/756,616
• Publication Number:
  US 20080297453A1
• Time in Patent Office: 2,728 Days
• Field of Search: 427/64
• US Class Current: 427/66
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0025 relating to coatings
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H10K 50/80 Constructional details
• CPC Class Codes: H10K 59/17 Passive-matrix OLED displays
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/40 Thermal treatment, e.g. annealing in the presence of a solvent vapour

Abstract

The present invention provides a method of manufacturing an electronic display. The exemplary method includes depositing a first conductive medium within a plurality of cavities of a substrate to form a plurality of first conductors. A plurality of electronic components in a suspending medium are then deposited within the plurality of cavities, and the plurality of electronic components are oriented using an applied field, followed by a bonding of the plurality of electronic components to the plurality of first conductors. A second, transmissive conductive medium is then deposited and bonded to the plurality of electronic components.

Claims

1. A method of manufacturing an electronic apparatus, the method comprising:

depositing a first conductive medium within a plurality of cavities of a flexible, substantially planar substrate to form a plurality of first conductors;

depositing a plurality of diodes suspended in a liquid within the plurality of cavities, the liquid comprising a solvent and an insulating binder, each diode of the plurality of diodes having a first contact and a second contact;

rotating and orienting at least some diodes of the plurality of diodes using an applied magnetic field while the plurality of diodes are suspended in the liquid, the rotation and orientation of the at least some diodes being in a plane substantially perpendicular to the plane of the flexible, substantially planar substrate and further providing for the first contacts of the at least some diodes to be in electrical contact with at least one first conductor of the plurality of first conductors;

curing the insulating binder while the at least some diodes are oriented by the applied magnetic field to form a cured insulating binder having a dielectric constant greater than about one, the curing at least partially exposing the second contacts of the at least some diodes; and

depositing a second, optically transmissive conductive medium to form a plurality of second conductors electrically coupled to the second contacts of the at least some diodes of the plurality of diodes.

2. The method of claim 1, wherein the curing step further comprises applying energy selected from the group consisting of:

ultraviolet radiation, infrared radiation, heat, and combinations thereof.

3. The method of claim 1, wherein the curing step further comprises:

evaporating the solvent.

4. The method of claim 1, wherein the curing step further comprises:

bonding the first contacts of the at least some diodes of the plurality of diodes to the plurality of first conductors.

5. The method of claim 4, wherein the bonding step further comprises:

bonding the first contacts of the at least some diodes of the plurality of diodes by abutment to or within the plurality of first conductors.

6. The method of claim 4, wherein the bonding step further comprises:

annealing the first contacts of the at least some diodes of the plurality of diodes to the plurality of first conductors.

7. The method of claim 4, further comprising:

curing the first conductive medium by applying ultraviolet radiation, or infrared radiation, or heat, or combinations thereof.

8. The method of claim 1, wherein the first conductive medium is a conductive ink.

9. The method of claim 1, wherein the second conducting medium is an optically transmissive polymer.

10. The method of claim 1, wherein the step of using the applied magnetic field further comprises using an electromagnetic field.

11. The method of claim 1, further comprising:

applying a sonic field subsequent to or during the deposition of the plurality of diodes.

12. The method of claim 1, further comprising:

vibrating the substrate subsequent to or during the deposition of the plurality of diodes.

13. The method of claim 1, wherein the plurality of cavities are integrally molded in the substrate.

14. The method of claim 1, wherein the substrate is embossed.

15. The method of claim 1, wherein the deposition steps further comprise printing.

16. The method of claim 1, wherein the deposition steps are selected from the group consisting of:

printing, coating, rolling, spraying, layering, sputtering, lamination, screen printing, inkjet printing, electro-optical printing, electroink printing, photoresist printing, thermal printing, laser jet printing, magnetic printing, pad printing, flexographic printing, hybrid offset lithography, Gravure printing, and combinations thereof.

17. The method of claim 1, wherein the step of depositing the first conductive medium further comprises coating the plurality of cavities with the first conductive medium and removing excess first conductive medium by scraping a surface of the substrate using a doctor blade.

18. The method of claim 1, wherein the step of depositing the plurality of diodes further comprises coating the plurality of cavities with the plurality of diodes and removing excess plurality of electronic components by scraping a surface of the substrate using a doctor blade.

19. The method of claim 1, wherein the plurality of diodes are light emitting diodes or photovoltaic diodes.

20. The method of claim 1, wherein the plurality of cavities are selected from the group consisting of:

are at least one of the following types of cavities;

channels, grooves, or substantially hemispherically-shaped depressions, bores, and combinations thereof.

21. The method of claim 1, further comprising:

depositing a third conductive medium over or within the plurality of second conductors.

22. The method of claim 1, wherein the electronic apparatus is an addressable light emitting diode display.

23. The method of claim 1, further comprising:

moving the plurality of diodes translationally using the applied magnetic field.

24. The method of claim 1, wherein the plurality of diodes are semiconductor diodes.

25. The method of claim 1, wherein the curing step further comprises:

removing the solvent.

26. A method of manufacturing an electronic apparatus, the method comprising:

depositing a first conductive medium on a flexible, substantially planar substrate to form a first conductor;

depositing a plurality of diodes suspended in a liquid, the liquid comprising a solvent and an insulating binder, each diode of the plurality of diodes having a first contact and a second contact;

rotating and orienting at least some diodes of the plurality of diodes using an applied magnetic field while the plurality of diodes are suspended in the liquid, the rotation and orientation of the at least some diodes being in a plane substantially perpendicular to the plane of the flexible, substantially planar substrate and further providing for the first contacts of the at least some diodes to be in electrical contact with the first conductor and for the second contacts of the at least some diodes to be rotated away and spaced apart from the plane of the flexible, substantially planar substrate;

curing the insulating binder while the at least some diodes are oriented by the applied magnetic field and in contact with the first conductor to form a cured insulating binder having a dielectric constant greater than about one, the curing at least partially exposing the second contacts of the at least some diodes; and

depositing a second, optically transmissive conductive medium electrically coupled to the second contacts of the at least some diodes of the plurality of diodes.

27. The method of claim 26, wherein the substrate has a plurality of cavities.

28. The method of claim 27, wherein the plurality of cavities are integrally molded in the substrate.

29. The method of claim 27, wherein the substrate is embossed.

30. The method of claim 27, wherein the step of depositing the first conductive medium further comprises depositing the first conductive medium in the plurality of cavities to form a plurality of first conductors.

31. The method of claim 27, wherein the step of depositing the first conductive medium further comprises coating the plurality of cavities with the first conductive medium and removing excess first conductive medium by scraping a surface of the substrate using a doctor blade.

32. The method of claim 27, wherein the step of depositing the plurality of diodes further comprises coating the plurality of cavities with the plurality of diodes and removing excess plurality of diodes by scraping a surface of the substrate using a doctor blade.

33. The method of claim 27, wherein the plurality of cavities are selected from the group consisting of:

channels, grooves, or substantially hemispherically-shaped depressions, bores, and combinations thereof.

34. The method of claim 26, wherein the step of depositing the second conductive medium further comprises depositing the second conductive medium to form a plurality of second conductors.

35. The method of claim 26, wherein the curing step further comprises applying energy selected from the group consisting of:

ultraviolet radiation, infrared radiation, heat, and combinations thereof.

36. The method of claim 35, wherein the curing step further comprises:

evaporating the solvent.

37. The method of claim 26, wherein the curing step further comprises:

bonding the first contacts of the at least some diodes of the plurality of diodes to the first conductor.

38. The method of claim 37, wherein the bonding step further comprises:

bonding the first contacts of the at least some diodes of the plurality of diodes by abutment to or within the first conductor.

39. The method of claim 37, wherein the bonding step further comprises:

annealing the first contacts of the at least some diodes of the plurality of diodes to the first conductor.

40. The method of claim 26, wherein the first conductive medium is a conductive ink.

41. The method of claim 40, further comprising:

curing the first conductive medium by applying ultraviolet radiation, or infrared radiation, or heat, or combinations thereof.

42. The method of claim 26, wherein the second conducting medium is an optically transmissive polymer.

43. The method of claim 26, wherein the step of using an applied magnetic field further comprises using an electromagnetic field.

44. The method of claim 26, further comprising:

applying a sonic field subsequent to or during the deposition of the plurality of diodes.

45. The method of claim 26, further comprising:

vibrating the substrate subsequent to or during the deposition of the plurality of diodes.

46. The method of claim 26, wherein the deposition steps further comprise printing.

47. The method of claim 26, wherein the deposition steps is selected from the group consisting of:

printing, coating, rolling, spraying, layering, sputtering, lamination, screen printing, inkjet printing, electro-optical printing, electroink printing, photoresist printing, thermal printing, laser jet printing, magnetic printing, pad printing, flexographic printing, hybrid offset lithography, Gravure printing, and combinations thereof.

48. The method of claim 26, wherein the second, optically transmissive conductive medium forms a second conductor and wherein the method further comprises:

depositing a third conductive medium over or within the second conductor.

49. The method of claim 26, wherein the plurality of diodes are light emitting diodes or photovoltaic diodes.

50. The method of claim 26, wherein the electronic apparatus is an addressable light emitting diode display.

51. The method of claim 26, wherein the electronic apparatus is a static or regionally-addressable light emitting diode display.

52. The method of claim 26, wherein the electronic apparatus is a light emitting diode lighting apparatus.

53. The method of claim 26, wherein the substrate is selected from the group consisting of:

paper, coated paper, plastic coated paper, embossed paper, fiber paper, cardboard, poster paper, poster board, plastic, rubber, fabric, and combinations thereof.

54. The method of claim 26, further comprising:

moving the plurality of diodes translationally using the applied magnetic field.

55. The method of claim 26, wherein the plurality of diodes are semiconductor diodes.

56. The method of claim 26, wherein the curing step further comprises:

removing the solvent.

57. A method of manufacturing an addressable light emitting display, the method comprising:

depositing a first conductive medium within a plurality of cavities of a flexible, substantially planar substrate to form a plurality of first conductors;

curing the first conductive medium using applied ultraviolet radiation or applied heat;

depositing a plurality of semiconductor light emitting diodes within the plurality of cavities, the plurality of semiconductor light emitting diodes suspended in a liquid medium, the liquid medium comprising a solvent and an insulating binder, each diode of the plurality of diodes having a first contact and a second contact;

rotating and orienting at least some semiconductor diodes of the plurality of semiconductor light emitting diodes into at least one selected position using an applied magnetic field, the rotation and orientation of the at least some diodes being in a plane substantially perpendicular to the plane of the flexible, substantially planar substrate and further providing for the first contacts of the at least some diodes to be in electrical contact with at least one first conductor of the plurality of first conductors and for the second contacts of the at least some diodes to be rotated away and spaced apart from the plane of the flexible, substantially planar substrate;

bonding the plurality of semiconductor light emitting diodes to the plurality of first conductors while the at least some semiconductor diodes are oriented by the applied magnetic field;

curing the insulating binder while the at least some semiconductor diodes are oriented by the applied magnetic field to form a cured insulating binder having a dielectric constant greater than about one, the curing at least partially exposing the second contacts of the at least some diodes;

depositing a second, optically transmissive conductive medium to form a plurality of second conductors coupled to the second contacts of the plurality of semiconductor light emitting diodes; and

depositing a third conductive medium over or within the plurality of second conductors.