Method and device including transistor component having a field electrode
First Claim
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1. A method of forming a transistor component, including:
- providing a semiconductor arrangement including;
a semiconductor body having a first side, at least one first trench extending from the first side, and having sidewalls and lower and upper trench sections, a first field electrode arranged in the lower trench section of the at least one first trench and being insulated from the semiconductor body by a field electrode dielectric, at least one second trench in the semiconductor body, the at least one second trench having sidewalls and lower and upper sidewall sections, and a second field electrode arranged in lower and upper trench sections of the at least one second trench and being insulated from the semiconductor body by the field electrode dielectric;
forming a dielectric layer on the first field electrode in the at least one first trench, forming the dielectric layer including a deposition process that deposits a dielectric material on the first side of the semiconductor body and on the field plate at a higher deposition rate than on sidewalls of the at least one first trench;
forming a gate dielectric, the gate dielectric at least lining the sidewalls in the upper trench section of the at least one first trench;
forming a gate electrode in the upper trench section, gate electrode being insulated from the first field electrode by the dielectric layer.
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Abstract
A transistor component and method of forming a transistor component. One embodiment provides a semiconductor arrangement including a semiconductor body having a at least one first trench, a first field electrode arranged in the lower trench section of the at least one first trench and being insulated from the semiconductor body by a field electrode dielectric. A dielectric layer is formed on the first field electrode in the at least one first trench, including depositing a dielectric material on a first side of the semiconductor body and on the field plate at a higher deposition rate than on sidewalls of the at least one first trench.
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Citations
19 Claims
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1. A method of forming a transistor component, including:
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providing a semiconductor arrangement including;
a semiconductor body having a first side, at least one first trench extending from the first side, and having sidewalls and lower and upper trench sections, a first field electrode arranged in the lower trench section of the at least one first trench and being insulated from the semiconductor body by a field electrode dielectric, at least one second trench in the semiconductor body, the at least one second trench having sidewalls and lower and upper sidewall sections, and a second field electrode arranged in lower and upper trench sections of the at least one second trench and being insulated from the semiconductor body by the field electrode dielectric;forming a dielectric layer on the first field electrode in the at least one first trench, forming the dielectric layer including a deposition process that deposits a dielectric material on the first side of the semiconductor body and on the field plate at a higher deposition rate than on sidewalls of the at least one first trench; forming a gate dielectric, the gate dielectric at least lining the sidewalls in the upper trench section of the at least one first trench; forming a gate electrode in the upper trench section, gate electrode being insulated from the first field electrode by the dielectric layer. - View Dependent Claims (2, 3)
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4. A method of making a device comprising:
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providing a semiconductor arrangement including a semiconductor body having at least one first trench extending from a first side, the at least one first trench having sidewalls and lower and upper trench sections, a first field electrode arranged in the lower trench section and being insulated from the semiconductor body by a field electrode dielectric; forming a dielectric layer on the first field electrode including depositing a dielectric material on the first side of the semiconductor body and on the first field electrode at a higher deposition rate than on sidewalls of the at least one first trench; forming agate dielectric, at least lining the sidewalls in the upper trench section; and forming a gate electrode in the upper trench section, insulated from the first field electrode by the dielectric layer, wherein forming the dielectric layer further includes; producing a protection layer covering the dielectric layer in the at least one first trench and on the first side, the protection layer completely filling the at least one first trench; completely removing the protection layer above the first side and at least partly removing the dielectric layer on the first side, and at least partly leaving the protection layer in the at least one first trench; and removing the protection layer from the at least one first trench. - View Dependent Claims (5, 6, 7, 8, 9, 10, 11)
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12. A method of making a device comprising:
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providing a semiconductor arrangement including a semiconductor body having at least one first trench extending from a first side, the at least one first trench having sidewalls and lower and upper trench sections, a first field electrode arranged in the lower trench section and being insulated from the semiconductor body by a field electrode dielectric; forming a dielectric layer on the first field electrode including depositing a dielectric material on the first side of the semiconductor body and on the first field electrode at a higher deposition rate than on sidewalls of the at least one first trench; forming a gate dielectric, at least lining the sidewalls in the upper trench section; and forming a gate electrode in the upper trench section, insulated from the first field electrode by the dielectric layer; wherein the semiconductor arrangement further includes; at least one third trench having lower and upper trench sections, and a MOS gated diode structure arranged in the trench. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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Specification