Method of fabricating semiconductor device
First Claim
1. A method of fabricating a semiconductor device, comprising:
- forming switching devices on a substrate;
forming a lower structure on the substrate having the switching devices;
forming a lower conductive layer on the lower structure;
forming sacrificial mask patterns on the lower conductive layer;
forming lower conductive patterns by etching the lower conductive layer using the sacrificial mask patterns as an etch mask;
forming an interlayer insulating layer on the substrate having the lower conductive patterns;
forming interlayer insulating patterns by planarizing the interlayer insulating layer until the sacrificial mask patterns are exposed;
forming openings exposing the lower conductive patterns by removing the exposed sacrificial mask patterns; and
forming upper conductive patterns self-aligned with the lower conductive patterns in the openings.
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Abstract
A method of fabricating a semiconductor device includes forming switching devices on a substrate. A lower structure is formed in the substrate having the switching devices. A lower conductive layer is formed on the lower structure. Sacrificial mask patterns are formed on the lower conductive layer. Lower conductive patterns are formed by etching the lower conductive layer using the sacrificial mask patterns as an etch mask. An interlayer insulating layer is formed on the substrate having the lower conductive patterns. Interlayer insulating patterns are formed by planarizing the interlayer insulating layer until the sacrificial mask patterns are exposed. Openings exposing the lower conductive patterns are formed by removing the exposed sacrificial mask patterns. Upper conductive patterns self-aligned with the lower conductive patterns are formed in the openings.
11 Citations
20 Claims
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1. A method of fabricating a semiconductor device, comprising:
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forming switching devices on a substrate; forming a lower structure on the substrate having the switching devices; forming a lower conductive layer on the lower structure; forming sacrificial mask patterns on the lower conductive layer; forming lower conductive patterns by etching the lower conductive layer using the sacrificial mask patterns as an etch mask; forming an interlayer insulating layer on the substrate having the lower conductive patterns; forming interlayer insulating patterns by planarizing the interlayer insulating layer until the sacrificial mask patterns are exposed; forming openings exposing the lower conductive patterns by removing the exposed sacrificial mask patterns; and forming upper conductive patterns self-aligned with the lower conductive patterns in the openings. - View Dependent Claims (2, 3, 4, 5)
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6. A method of fabricating a semiconductor device, comprising:
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forming a lower insulating layer on a substrate; forming a lower conductive structure form on the lower insulating layer; forming, on the lower conductive structure, sacrificial mask patterns having a thickness greater than the thickness of the lower conductive structure; forming lower conductive patterns by etching the lower conductive structure using the sacrificial mask patterns as an etch mask; forming an interlayer insulating layer on the substrate having the lower conductive patterns; forming interlayer insulating patterns by planarizing the interlayer insulating layer to such an extent that upper parts of the sacrificial mask patterns are exposed; forming openings by removing the exposed sacrificial mask patterns; and forming upper conductive patterns in the openings such that the upper conductive patterns are formed as stacked on the lower conductive patterns, respectively, each of the lower conductive patterns and the upper conductive pattern stacked thereon constituting a respective interconnection structure, and wherein the interconnection structures are formed to have a thickness greater than the distance between adjacent ones of the interconnection structures. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of fabricating a semiconductor device, comprising:
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forming a lower conductive structure of at least one layer of material on a substrate; forming a sacrificial layer on the lower conductive structure, and patterning the sacrificial layer to form lines of sacrificial mask patterns on the lower conductive structure; etching the at least one layer of material using the sacrificial mask patterns as an etch mask to form lower conductive patterns each having the shape of a line; forming an interlayer insulating layer on the substrate having the lower conductive patterns; planarizing the interlayer insulating layer to such an extent that upper parts of the sacrificial mask patterns are exposed and thereby forming interlayer insulating patterns each having the shape of a line from the interlayer insulating layer; and forming upper conductive patterns as stacked on the lower conductive patterns, respectively, using a damascene process that comprises forming openings having the shapes of lines by removing the exposed sacrificial mask patterns and forming conductive material in the openings, such that each of the lower conductive patterns and the upper conductive pattern stacked thereon constitute a respective interconnection structure having the shape of a line, and wherein the upper conductive patterns are formed to have a resistivity lower than that of the lower conductive patterns. - View Dependent Claims (17, 18, 19, 20)
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Specification