Light emitting device surrounded by reflection wall and covered with fluorescent film

• US 8,890,188 B2
• Filed: 11/07/2011
• Issued: 11/18/2014
• Est. Priority Date: 11/10/2010
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Park, Na Na, Park, Il Woo, Kwak, Chang Hoon
• Primary Examiner(s): Smoot, Stephen W
• Application Number:
  US13/290,639
• Publication Number:
  US 20120112229A1
• Time in Patent Office: 1,107 Days
• Field of Search: 257/E33.07
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device package includes: first and second electrodes, at least a portion of a lower surface thereof being exposed; a light emitting device disposed on an upper surface of at least one of the first and second electrodes; a reflection wall disposed on the upper surface of the first and second electrodes and surrounding the light emitting device to form a mounting part therein; and a fluorescent film disposed on the reflection wall to cover an upper portion of the mounting part. The mounting part is filled with air.

Claims

1. A light emitting device package comprising:

first and second electrodes, at least a portion of a lower surface thereof being exposed;

a light emitting device disposed on an upper surface of at least one of the first and second electrodes;

a reflection wall disposed on the upper surface of the first and second electrodes and surrounding the light emitting device to form a mounting part therein; and

a fluorescent film disposed on the reflection wall to cover an upper portion of the mounting part, wherein;

the mounting part is filled with air, and

at least a portion of the fluorescent film is bonded to the light emitting device.

2. The light emitting device package of claim 1, wherein at least portions of the first and second electrodes, the reflection wall, and the fluorescent film are coplanar to form a side.

3. The light emitting device package of claim 1, wherein the light emitting device is electrically connected to the first and second electrodes through a soldering layer.

4. The light emitting device package of claim 1, wherein a plurality of light emitting devices are disposed and electrically connected to each other through the first and second electrodes, and the reflection wall surrounds each of the plurality of light emitting devices to form a plurality of mounting parts.

5. The light emitting device package of claim 1, wherein the fluorescent film is formed by stacking a plurality of films.

6. The light emitting device package of claim 1, wherein the fluorescent film converts light emitted from the light emitting device such that the light has at least one wavelength among yellow, red, and green.

7. The light emitting device package of claim 1, wherein the fluorescent film is configured to include an encapsulant and phosphors mixed in the encapsulant.

8. The light emitting device package of claim 1, wherein the reflection wall surrounds the light emitting device, and has a rectangular shape.

9. The light emitting device package of claim 1, wherein the first and second electrodes are made of a material having light transmittance properties.

10. The light emitting device package of claim 1, wherein the reflection wall is made of a material obtained by adding a dispersing agent to silicon.

11. The light emitting device package of claim 1, wherein the fluorescent film is bonded on the reflection wall immediately after the light emitting device is disposed on the upper surface of at least one of the first and second electrodes.

12. The light emitting device package of claim 1, wherein no molding resin is disposed in the mounting part.