Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance

• US 8,893,513 B2
• Filed: 05/07/2013
• Issued: 11/25/2014
• Est. Priority Date: 05/07/2012
• Status: Active Grant

• Current Assignee: Phononic, Inc.
• Original Assignee: Phononic Device Incorporated
• Inventors: June, M. Sean, Therrien, Robert Joseph, Yadav, Abhishek, Edwards, Jesse W.
• Primary Examiner(s): Ciric, Ljiljana
• Assistant Examiner(s): COX, ALEXIS K
• Application Number:
  US13/888,847
• Publication Number:
  US 20130291559A1
• Time in Patent Office: 567 Days
• Field of Search: 62/32, 62/37, 165/134.1
• US Class Current: 62/3.7
• CPC Class Codes: F25B 21/00 Machines, plants or systems, using electric or magnetic effects
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/066 Heatsink mounted on the surface of the printed circuit board [PCB]
• CPC Class Codes: H05K 2201/10219 Thermoelectric component
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A thermoelectric heat exchanger component includes a circuit board and multiple thermoelectric devices attached to the circuit board. Heights of at least two of the thermoelectric devices are different due to, for example, tolerances in a manufacturing process for the thermoelectric devices. The thermoelectric heat exchanger component also includes a first heat spreading lid over a first surface of the thermoelectric devices and a second heat spreading lid over a second surface of the thermoelectric devices. A thermal interface material is present between each one of the thermoelectric devices and the first and second heat spreading lids. The first heat spreading lid and the second heat spreading lid are oriented such that the thickness of the thermal interface material, and thus a thermal interface resistance, is optimized for the thermoelectric devices.

Claims

1. A thermoelectric heat exchanger component, comprising:

a circuit board;

a plurality of thermoelectric devices attached to the circuit board, wherein two or more of the plurality of thermoelectric devices have different heights relative to the circuit board;

a heat spreading lid over the plurality of thermoelectric devices; and

a thermal interface material between the plurality of thermoelectric devices and the heat spreading lid;

wherein the heat spreading lid is oriented such that the thickness of the thermal interface material, and thus a thermal interface resistance, is minimized for the plurality of thermoelectric devices.

2. The thermoelectric heat exchanger component of claim 1 wherein:

the plurality of thermoelectric devices are attached to a first surface of the circuit board and include a first surface opposite the first surface of the circuit board and a second surface opposite the first surface;

the two or more of the plurality of thermoelectric devices have different heights relative to the first surface of the circuit board;

the heat spreading lid is on the first surfaces of the plurality of thermoelectric devices opposite the first surface of the circuit board; and

the thermal interface material is between the first surfaces of the plurality of thermoelectric devices and the heat spreading lid.

3. The thermoelectric heat exchanger of claim 2 further comprising:

a second heat spreading lid on the second surfaces of the plurality of thermoelectric devices exposed at a second surface of the circuit board through one or more holes through the circuit board; and

a second thermal interface material between the plurality of thermoelectric devices and the second heat spreading lid;

wherein the second heat spreading lid is oriented such that the thickness of the second thermal interface material, and thus a thermal interface resistance, is minimized for the plurality of thermoelectric devices.

4. The thermoelectric heat exchanger component of claim 2 wherein the heat spreading lid comprises:

a body; and

a plurality of pedestals of equal heights that extend from the body toward the first surfaces of the plurality of thermoelectric devices such that each pedestal of the plurality of pedestals is aligned with a corresponding one of the plurality of thermoelectric devices;

wherein the thermal interface material is between a surface of each pedestal of the plurality of pedestals and the first surface of the corresponding one of the plurality of thermoelectric devices, and the orientation of the heat spreading lid is such that the thickness of the thermal interface material between each pedestal of the plurality of pedestals and the first surface of the corresponding one of the plurality of thermoelectric devices is minimized for the plurality of thermoelectric devices.

5. The thermoelectric heat exchanger component of claim 4 wherein the thermal interface material is one of a group consisting of:

solder and thermal grease.

6. The thermoelectric heat exchanger component of claim 4 wherein each pedestal of the plurality of pedestals is a parallelepiped.

7. The thermoelectric heat exchanger component of claim 4 wherein each pedestal of the plurality of pedestals is a frustum.

8. The thermoelectric heat exchanger component of claim 4 wherein an area of the surface of each pedestal of the plurality of pedestals is in a range of and including 1 to 10 percent smaller than an area of the first surface of the corresponding one of the plurality of thermoelectric devices.

9. The thermoelectric heat exchanger component of claim 4 wherein the heat spreading lid further comprises a lip that extends from the body of the heat spreading lid around a periphery of the heat spreading lid.

10. The thermoelectric heat exchanger component of claim 9 wherein a height of the lip relative to the body of the heat spreading lid is such that, for any combination of heights of the plurality of thermoelectric devices within a predefined tolerance range, at least a predefined minimum gap is maintained between the lip of the heat spreading lid and the first surface of the circuit board, wherein the at least the predefined minimum gap is greater than zero.

11. The thermoelectric heat exchanger component of claim 10 further comprising an attach material that fills the at least the predefined minimum gap between the lip of the heat spreading lid and the first surface of the circuit board around the periphery of the heat spreading lid.

12. The thermoelectric heat exchanger component of claim 11 wherein the lip of the heat spreading lid and the attach material absorb force applied to the heat spreading lid so as to protect the plurality of thermoelectric devices.

13. The thermoelectric heat exchanger component of claim 11 wherein the attach material is an epoxy.

14. The thermoelectric heat exchanger component of claim 11 further comprising a thermal insulator preform having a hole with dimensions that correspond to dimensions of the heat spreading lid, the thermal insulator preform being positioned over the circuit board such that the heat spreading lid passes through the hole in the thermal insulator preform.

15. The thermoelectric heat exchanger component of claim 1 wherein:

the plurality of thermoelectric devices are attached to a first surface of the circuit board and include a first surface opposite the first surface of the circuit board and a second surface opposite the first surface;

the heat spreading lid is over the first surfaces of the plurality of thermoelectric devices that are exposed at a second surface of the circuit board through one or more holes through the circuit board;

the two or more of the plurality of thermoelectric devices have different heights relative to the second surface of the circuit board; and

the thermal interface material is between the first surfaces of the plurality of thermoelectric devices and the heat spreading lid.

16. The thermoelectric heat exchanger component of claim 15 wherein the heat spreading lid comprises:

a body; and

a plurality of pedestals of equal heights that extend from the body toward the first surfaces of the plurality of thermoelectric devices such that each pedestal of the plurality of pedestals is aligned with a corresponding one of the plurality of thermoelectric devices;

wherein the thermal interface material is between each pedestal of the plurality of pedestals and the first surface of the corresponding one of the plurality of thermoelectric devices, and the heat spreading lid is oriented such that the thickness of the thermal interface material between each pedestal of the plurality of pedestals and the first surface of the corresponding one of the plurality of thermoelectric devices, and thus a thermal interface resistance, is minimized for the plurality of thermoelectric devices.

17. The thermoelectric heat exchanger component of claim 16 wherein the thermal interface material is one of a group consisting of:

solder and thermal grease.

18. The thermoelectric heat exchanger component of claim 16 wherein each pedestal of the plurality of pedestals is a parallelepiped.

19. The thermoelectric heat exchanger component of claim 16 wherein each pedestal of the plurality of pedestals is a frustum.

20. The thermoelectric heat exchanger component of claim 16 wherein an area of a surface of each pedestal of the plurality of pedestals is in a range of and including 1 to 10 percent smaller than an area of the first surface of the corresponding one of the plurality of thermoelectric devices.

21. The thermoelectric heat exchanger component of claim 16 wherein the heat spreading lid further comprises a lip that extends from the body of the heat spreading lid around a periphery of the heat spreading lid.

22. The thermoelectric heat exchanger component of claim 21 wherein a height of the lip relative to the body of the heat spreading lid is such that, for any combination of heights of the plurality of thermoelectric devices within a predefined tolerance range, at least a predefined minimum gap is maintained between the lip of the heat spreading lid and the second surface of the circuit board, wherein the at least the predefined minimum gap is greater than zero.

23. The thermoelectric heat exchanger component of claim 22 further comprising an attach material that fills the at least the predefined minimum gap between the lip of the heat spreading lid and the second surface of the circuit board around the periphery of the heat spreading lid.

24. The thermoelectric heat exchanger component of claim 23 wherein the lip of the heat spreading lid and the attach material absorb force applied to the heat spreading lid so as to protect the plurality of thermoelectric devices.

25. The thermoelectric heat exchanger component of claim 23 wherein the attach material is an epoxy.

26. The thermoelectric heat exchanger component of claim 23 further comprising a thermal insulator preform having a hole with dimensions that correspond to dimensions of the heat spreading lid, the thermal insulator preform being positioned over the circuit board such that the heat spreading lid passes through the hole in the thermal insulator preform.