Tamper-resistant electronic system

• US 8,893,976 B1
• Filed: 07/18/2013
• Issued: 11/25/2014
• Est. Priority Date: 07/18/2013
• Status: Active Grant

• Current Assignee: American Private Label, LLC
• Original Assignee: American Private Label, LLC
• Inventors: Neuman, David, Neuman, Robert, Lindblad, Scott
• Primary Examiner(s): TRAIL, ALLYSON NEEL
• Application Number:
  US13/945,016
• Time in Patent Office: 495 Days
• Field of Search: 235/488, 235/492, 340/572.1, 340/572.7
• US Class Current: 235/488
• CPC Class Codes: B60R 2325/105 Radio frequency identification data [RFID]
• CPC Class Codes: G06K 19/07798 part of the antenna or the integrated circuit being adapted for rupturing or breaking, e.g. record carriers functioning as sealing devices for detecting not-authenticated opening of containers electronic seals G09F3/03
• CPC Class Codes: G08G 1/017 identifying vehicles G08G1/015, G08G1/054 take precedence
• CPC Class Codes: G09F 3/0292 tamper indicating labels
• CPC Class Codes: G09F 3/0297 including a machine-readable marking, e.g. a bar code digitally marked record carriers in general G06K19/00

Abstract

A tamper-resistant electronic system includes a destructible vinyl (DV) substrate having conductive wiring disposed on a first surface of the DV substrate. An RFID device has pins mechanically and electrically connected to the wiring on the first surface of the DV substrate. A plate has a first surface, and a portion of the first surface of the plate is adhered to a portion of the first surface of the DV substrate. The plate has a cavity that encompasses the RFID device. A backing is adhered to a second surface of the plate opposite the first surface of the plate.

Claims

1. A tamper-resistant electronic system, comprising:

a destructible vinyl (DV) substrate having conductive wiring disposed on a first surface of the DV substrate;

an RFID device having pins mechanically and electrically connected to the conductive wiring on the first surface of the DV substrate;

a plate having a first surface, wherein a portion of the first surface of the plate is adhered to a portion of the first surface of the DV substrate, and the plate has a cavity that encompasses the RFID device; and

a backing adhered to a second surface of the plate opposite the first surface of the plate.

2. The tamper-resistant electronic system of claim 1, wherein the plate is more rigid than the DV substrate.

3. The tamper-resistant electronic system of claim 1, wherein the portion of the first surface of the plate that is adhered to the portion of the first surface of the DV substrate includes strips on the first surface of the plate along edges of the plate and excludes all other areas of the first surface of the plate.

4. The tamper-resistant electronic system of claim 1, wherein the portion of the first surface of the plate that is adhered to the portion of the first surface of the DV substrate excludes an area of the first surface of the plate that surrounds the RFID device.

5. The tamper-resistant electronic system of claim 1, wherein a portion of the plate is disposed between the RFID device and the DV substrate.

6. The tamper-resistant electronic system of claim 5, wherein the portion of the plate disposed between the RFID device and the DV substrate extends from one side of the RFID device to an opposite side of the RFID device.

7. The tamper-resistant electronic system of claim 1, wherein the backing is adhered to a first surface of the RFID device that is opposite a second surface of the RFID device that faces the first surface of the DV substrate.

8. The tamper-resistant electronic system of claim 1, wherein the RFID device is disposed between a recessed portion of the plate formed by the cavity and the first surface of the DV substrate.

9. The tamper-resistant electronic system of claim 8, wherein the recessed portion of the plate is glued to the first surface of the RFID device.

10. The tamper-resistant electronic system of claim 1, wherein the conductive wiring forms an antenna on the first surface of the DV substrate.

11. The tamper-resistant electronic system of claim 10, wherein the plate covers the antenna.

12. The tamper-resistant electronic system of claim 1, wherein the backing is vinyl.

13. The tamper-resistant electronic system of claim 1, wherein the plate is acrylonitrile butadiene styrene (ABS) thermoplastic.

14. The tamper-resistant electronic system of claim 1, wherein the plate is approximately as thick as the RFID device.

15. The tamper-resistant electronic system of claim 1, wherein pressure sensitive adhesive adheres the backing to the DV substrate, to the RFID device, and to the plate.

16. The tamper-resistant electronic system of claim 1, further comprising an adhesive layer on a second surface of the DV substrate, and a temporary backing attached to the adhesive layer on the second surface of the DV substrate.

17. The tamper-resistant electronic system of claim 1, wherein the plate is one of polygonal or circular.

18. The tamper-resistant electronic system of claim 1, wherein the cavity that encompasses the RFID device leaves a first surface of the RFID device that is opposite a second surface of the RFID device that faces the first surface of the DV substrate, exposed to the backing.

19. The tamper-resistant electronic system of claim 1, wherein the tamper-resistant electronic system further includes an adhesive between the backing and the plate.

20. The tamper-resistant electronic system of claim 1, wherein the tamper-resistant electronic system further includes an adhesive between the DV substrate and the plate.

21. A tamper-resistant electronic system, comprising:

a destructible vinyl (DV) substrate having conductive wiring disposed on a first surface of the DV substrate;

an RFID device having pins mechanically and electrically connected to the conductive wiring on the first surface of the DV substrate;

a plate having a first surface and being more rigid than the DV substrate, wherein a portion of the first surface of the plate, exclusive of an area of the first surface of the plate that surrounds the RFID device, is adhered to a portion of the first surface of the DV substrate, and the plate has a cavity that encompasses the RFID device;

a backing adhered to a second surface of the plate opposite the first surface of the plate; and

an adhesive layer on a second surface of the DV substrate, and a temporary backing attached to the adhesive layer on the second surface of the DV substrate.

22. The tamper-resistant electronic system of claim 21, wherein a portion of the plate is disposed between the RFID device and the DV substrate.

23. The tamper-resistant electronic system of claim 21, wherein the tamper-resistant electronic system further includes an adhesive between the backing and the plate.

24. The tamper-resistant electronic system of claim 21, wherein the tamper-resistant electronic system further includes an adhesive between the DV substrate and the plate.