Field effect transistor and method for manufacturing the same
First Claim
1. A method for manufacturing a field effect transistor comprising the steps of:
- forming a first conductive layer over a substrate;
forming an insulating film over the first conductive layer;
patterning the insulating film and then patterning the first conductive layer so that the patterned first conductive layer has substantially the same shape as the patterned insulating film;
forming a semiconductor layer over and in contact with the patterned insulating film so that the semiconductor layer does not overlap with any side edge of the patterned first conductive layer;
forming an oxide insulating layer over the semiconductor layer;
providing an opening reaching the semiconductor layer in the oxide insulating layer; and
forming a second conductive layer covering the oxide insulating layer.
1 Assignment
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Accused Products
Abstract
Provided is a novel structure of a field effect transistor using a metal-semiconductor junction. The field effect transistor includes a wiring which is provided over a substrate and also functions as a gate electrode; an insulating film which is provided over the wiring, has substantially the same shape as the wiring, and also functions as a gate insulating film; a semiconductor layer which is provided over the insulating film and includes an oxide semiconductor and the like; an oxide insulating layer which is provided over the semiconductor layer and whose thickness is 5 times or more as large as the sum of the thickness of the insulating film and the thickness of the semiconductor layer or 100 nm or more; and wirings which are connected to the semiconductor layer through openings provided in the oxide insulating layer.
123 Citations
24 Claims
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1. A method for manufacturing a field effect transistor comprising the steps of:
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forming a first conductive layer over a substrate; forming an insulating film over the first conductive layer; patterning the insulating film and then patterning the first conductive layer so that the patterned first conductive layer has substantially the same shape as the patterned insulating film; forming a semiconductor layer over and in contact with the patterned insulating film so that the semiconductor layer does not overlap with any side edge of the patterned first conductive layer; forming an oxide insulating layer over the semiconductor layer; providing an opening reaching the semiconductor layer in the oxide insulating layer; and forming a second conductive layer covering the oxide insulating layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for manufacturing a field effect transistor comprising the steps of:
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forming a first conductive layer over a substrate; forming an insulating film over the first conductive layer; forming an insulating layer by patterning the insulating film and then forming a wiring by patterning the first conductive layer by using the insulating layer as a mask; forming a semiconductor layer over and in contact with the insulating layer so that the semiconductor layer does not overlap with any side edge of the wiring; forming an oxide insulating layer over the semiconductor layer; providing an opening reaching the semiconductor layer in the oxide insulating layer; and forming a second conductive layer covering the oxide insulating layer. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A method for manufacturing a field effect transistor comprising the steps of:
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forming a first conductive layer over a substrate; forming an insulating film over the first conductive layer; forming an insulating layer by patterning the insulating film and then forming a wiring by patterning the first conductive layer with a resist mask over the insulating layer; forming a semiconductor layer over and in contact with the insulating layer so that the semiconductor layer does not overlap with any side edge of the wiring; forming an oxide insulating layer over the semiconductor layer; providing an opening reaching the semiconductor layer in the oxide insulating layer; and forming a second conductive layer covering the oxide insulating layer. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24)
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Specification