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Release strategies for making transferable semiconductor structures, devices and device components

  • US 8,895,406 B2
  • Filed: 03/24/2011
  • Issued: 11/25/2014
  • Est. Priority Date: 09/20/2006
  • Status: Active Grant
First Claim
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1. A method for making a device or device component, said method comprising the steps of:

  • providing a sacrificial layer on at least a portion of a substrate surface, said sacrificial layer having a receiving surface;

    patterning said sacrificial layer to generate a pattern of exposed substrate surface;

    depositing a functional layer on at least a portion of said sacrificial layer receiving surface and exposed substrate surface pattern, thereby generating a plurality of functional layer anchors corresponding to said pattern of exposed substrate;

    releasing at least a portion of said functional layer, wherein the plurality of functional layer anchors remain at least partially anchored to said substrate and at least a portion of said functional layer not anchored to said substrate is released, thereby generating a plurality of transferable structures; and

    printing said plurality of transferable structures onto a device substrate or device component supported by a device substrate;

    wherein said functional layer is part of a multilayer structure, and the multilayer structure comprises a plurality of functional layers and adjacent functional layers are separated by a sacrificial layer.

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