Wafer-level flip chip device packages and related methods

• US 8,896,010 B2
• Filed: 07/24/2013
• Issued: 11/25/2014
• Est. Priority Date: 01/24/2012
• Status: Expired due to Fees

• Current Assignee: Cooledge Lighting Inc.
• Original Assignee: Cooledge Lighting Inc.
• Inventors: Tischler, Michael A.
• Primary Examiner(s): GREEN, TELLY D
• Application Number:
  US13/949,546
• Publication Number:
  US 20140175481A1
• Time in Patent Office: 489 Days
• Field of Search: 257/98, 257/89, 438/27, 438/29, 438/25, 438/28, 438/31, 313/503, 313/501, 313/512, 362/231, 362/97.3, 362/237, 362/606
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/73104 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/83191 wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 24/27 Manufacturing methods
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 24/96 the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/14645 Colour imagers
• CPC Class Codes: H01L 27/14649 Infrared imagers
• CPC Class Codes: H01L 27/14658 X-ray, gamma-ray or corpuscular radiation imagers measuring X-, gamma- or corpuscular radiation G01T1/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/12032 Schottky diode
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 31/02005 for device characterised by at least one potential jump barrier or surface barrier
• CPC Class Codes: H01L 31/02008 : for solar cells or solar cell modules
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02322 : comprising luminescent members, e.g. fluorescent sheets upon the device
• CPC Class Codes: H01L 31/02325 : the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H01L 31/048 : Encapsulation of modules
• CPC Class Codes: H01L 31/054 : Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
• CPC Class Codes: H01L 31/055 : where light is absorbed and re-emitted at a different wavelength by the optical element directly associated or integrated with the PV cell, e.g. by using luminescent material, fluorescent concentrators or up-conversion arrangements
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/505 : characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 : the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05B 33/10 : Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
• CPC Class Codes: H05B 33/14 : characterised by the chemical or physical composition or the arrangement of the electroluminescent material , or by the simultaneous addition of the electroluminescent material in or onto the light source
• CPC Class Codes: Y02E 10/52 : PV systems with concentrators

Abstract

In accordance with certain embodiments, semiconductor dies are at least partially coated with a polymer and a conductive adhesive prior being bonded to a substrate having electrical traces thereon.

Claims

1. An electronic device comprising:

a solid shaped volume of a polymeric binder;

suspended within the binder, a semiconductor die having a first face, a second face opposite the first face, and at least one sidewall spanning the first and second faces, the semiconductor die being a bare-die light-emitting element comprising a plurality of active semiconductor layers that cooperatively emit light;

disposed on the first face of the semiconductor die, at least two spaced-apart contacts each having a terminal end not covered by the polymeric binder, the contacts each contacting a different active semiconductor layer of the semiconductor die; and

disposed over a portion of the polymeric binder and in electrical contact with the terminal ends of the contacts, an anisotropic conductive adhesive (ACA),

wherein (i) at least a portion of the polymeric binder is transparent to a wavelength of light emitted by the bare-die light-emitting element and (ii) the polymeric binder contains therein a wavelength-conversion material for absorption of at least a portion of light emitted from the bare-die light-emitting element and emission of converted light having a different wavelength, converted light and unconverted light emitted by the bare-die light-emitting element combining to form mixed light.

2. The electronic device of claim 1, wherein the ACA comprises an anisotropic conductive film.

3. The electronic device of claim 1, wherein at least a portion of the ACA opposite the contacts is free and available for electrical connection.

4. The electronic device of claim 1, wherein the polymeric binder and semiconductor die collectively define a rectangular solid having approximately 90°

corners between adjacent faces thereof.

5. The electronic device of claim 1, wherein at least portions of the contacts protrude from the polymeric binder.

6. The electronic device of claim 1, wherein only a portion of each said sidewall protrudes from the polymeric binder, a portion of each said sidewall being covered with the polymeric binder.

7. The electronic device of claim 1, wherein the polymeric binder comprises at least one of—

silicone or epoxy.

8. The electronic device of claim 1, further comprising one or more additional semiconductor dies suspended within the polymeric binder.

9. The electronic device of claim 1, wherein the wavelength-conversion material comprises at least one of a phosphor or quantum dots.

10. The electronic device of claim 1, wherein the light-emitting element comprises a semiconductor material comprising at least one of GaAs, AlAs, InAs, GaP, AlP, InP, ZnO, CdSe, CdTe, ZnTe, GaN, AlN, InN, silicon, or an alloy or mixture thereof.

11. The electronic device of claim 1, wherein the mixed light is substantially white light.

12. The electronic device of claim 11, wherein the substantially white light has a correlated color temperature in the range of 2000 K to 10,000 K.

13. The electronic device of claim 1, wherein the polymeric binder has a thickness between 5 μ

m and 2000 μ

m.

14. The electronic device of claim 13, wherein a dimension of the polymeric binder perpendicular to the thickness is between 25 μ

m and 50 mm.

15. The electronic device of claim 1, further comprising an optical element positioned to receive light from the semiconductor die.

16. The electronic device of claim 1, further comprising a reflecting layer over or within at least a portion of the polymeric binder.

17. The electronic device of claim 16, wherein the reflecting layer comprises at least one of (i) a reflecting film or (ii) a plurality of particles.

18. The electronic device of claim 1, wherein the reflecting layer has a reflectivity of at least 40% to a wavelength of light emitted by the wavelength-conversion material within the polymeric binder.

19. The electronic device of claim 1, wherein the polymeric binder comprises a plurality of discrete regions, at least one of which comprises the polymeric binder without wavelength-conversion material therein.

20. The electronic device of claim 1, wherein the active semiconductor layers of the semiconductor die are not disposed on a semiconductor substrate.

21. The electronic device of claim 1, wherein the polymeric binder coats the first face of the semiconductor die, the at least one sidewall of the semiconductor die, and at least a portion of the second face of the semiconductor die.

22. The electronic device of claim 1, wherein the terminal ends of the at least two contacts are in physical contact with the ACA.

23. The electronic device of claim 1, wherein at least a portion of the ACA is not activated to enable electrical conduction through a thickness thereof to the at least two contacts.

24. The electronic device of claim 1, further comprising a substrate having a plurality of conductive elements disposed thereon, wherein (i) at least two said contacts on the first face of the semiconductor die are each electrically coupled to a different conductive element on the substrate via the ACA and (ii) the at least two said contacts are electrically insulated from each other through the ACA.