Wafer-level flip chip device packages and related methods
First Claim
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1. An electronic device comprising:
- a solid shaped volume of a polymeric binder;
suspended within the binder, a semiconductor die having a first face, a second face opposite the first face, and at least one sidewall spanning the first and second faces, the semiconductor die being a bare-die light-emitting element comprising a plurality of active semiconductor layers that cooperatively emit light;
disposed on the first face of the semiconductor die, at least two spaced-apart contacts each having a terminal end not covered by the polymeric binder, the contacts each contacting a different active semiconductor layer of the semiconductor die; and
disposed over a portion of the polymeric binder and in electrical contact with the terminal ends of the contacts, an anisotropic conductive adhesive (ACA),wherein (i) at least a portion of the polymeric binder is transparent to a wavelength of light emitted by the bare-die light-emitting element and (ii) the polymeric binder contains therein a wavelength-conversion material for absorption of at least a portion of light emitted from the bare-die light-emitting element and emission of converted light having a different wavelength, converted light and unconverted light emitted by the bare-die light-emitting element combining to form mixed light.
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Abstract
In accordance with certain embodiments, semiconductor dies are at least partially coated with a polymer and a conductive adhesive prior being bonded to a substrate having electrical traces thereon.
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Citations
24 Claims
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1. An electronic device comprising:
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a solid shaped volume of a polymeric binder; suspended within the binder, a semiconductor die having a first face, a second face opposite the first face, and at least one sidewall spanning the first and second faces, the semiconductor die being a bare-die light-emitting element comprising a plurality of active semiconductor layers that cooperatively emit light; disposed on the first face of the semiconductor die, at least two spaced-apart contacts each having a terminal end not covered by the polymeric binder, the contacts each contacting a different active semiconductor layer of the semiconductor die; and disposed over a portion of the polymeric binder and in electrical contact with the terminal ends of the contacts, an anisotropic conductive adhesive (ACA), wherein (i) at least a portion of the polymeric binder is transparent to a wavelength of light emitted by the bare-die light-emitting element and (ii) the polymeric binder contains therein a wavelength-conversion material for absorption of at least a portion of light emitted from the bare-die light-emitting element and emission of converted light having a different wavelength, converted light and unconverted light emitted by the bare-die light-emitting element combining to form mixed light. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification