Integrated circuit and manufacturing method

• US 8,896,073 B2
• Filed: 01/21/2013
• Issued: 11/25/2014
• Est. Priority Date: 01/31/2012
• Status: Active Grant

• Current Assignee: ams AG (Ams-Osram AG)
• Original Assignee: NXP B.V. (NXP Semiconductors NV)
• Inventors: Ponomarev, Youri Victorovitch, Tio Castro, David, Daamen, Roel
• Primary Examiner(s): McCall Shepard, Sonya D
• Application Number:
  US13/745,918
• Publication Number:
  US 20130193417A1
• Time in Patent Office: 673 Days
• Field of Search: None
• US Class Current: 257/414
• CPC Class Codes: G01N 27/048 for determining moisture content of the material
• CPC Class Codes: G01N 27/121 for determining moisture content, e.g. humidity, of the fluid moisture content of the tested material G01N27/048
• CPC Class Codes: G01N 27/223 for determining moisture content, e.g. humidity rain detectors on vehicle windows B60S1/0825
• CPC Class Codes: G01N 33/0036 Specially adapted to detect a particular component all the other sub-groups of G01N33/0004 take precedence
• CPC Class Codes: H01L 27/144 Devices controlled by radiation
• CPC Class Codes: H01L 31/18 Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• CPC Class Codes: H10K 30/00 Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation integrated devices or assemblies of multiple devices H10K39/00, H10K65/00; electrolytic light-sensitive devices H01G9/20
• CPC Class Codes: H10K 85/10 Organic polymers or oligomers
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

Disclosed is an integrated circuit comprising a substrate including at least one light sensor; an interconnect structure over the substrate; at least one passivation layer over the interconnect structure, said passivation layer including a first area over the at least one light sensor; and a gas sensor such as a moisture sensor at least partially on a further area of the at least one passivation layer, wherein the gas sensor comprises a gas sensitive layer in between a first electrode and a second electrode, the gas sensitive layer further comprising a portion over the first area. A method of manufacturing such an IC is also disclosed.

Claims

1. An integrated circuit comprising:

a substrate including at least one light sensor;

an interconnect structure over the substrate, the interconnect structure at least partially transparent to light such that light from outside the integrated circuit can reach the at least one light sensor;

at least one passivation layer over the interconnect structure, said passivation layer including a first area over the at least one light sensor;

and a gas sensor at least partially on a further area of the at least one passivation layer, wherein the gas sensor comprises a gas sensitive layer in between a first electrode and a second electrode, the gas sensitive layer further comprising a portion over the first area.

2. The integrated circuit of claim 1, wherein the gas sensor is operable to detect moisture.

3. The integrated circuit of claim 2, wherein the gas sensor is a relative humidity sensor.

4. The integrated circuit of claim 1, wherein the gas sensitive layer is a polymer layer.

5. The integrated circuit of claim 4, wherein the polymer layer is selected from the group consisting of polyacrylates, polymethacrylates, polyimides, polyamides, polyamines, polypyridines, polycarbonates, polyacetates, polystyrenes, polyacetylenes, polyanilines, polypyrroles, polythiophenes, poly(phenyl vinylene) and derivatives thereof.

6. The integrated circuit of claim 5, wherein the polymer is a polyimide.

7. The integrated circuit of claim 1, wherein the gas sensitive layer further comprises a dye in at least said portion.

8. The integrated circuit of any of claim 1, wherein the light sensor is a photosensitive diode.

9. The integrated circuit of any of claim 1, comprising a further light sensor in the substrate under an area of the at least one passivation layer uncovered by said portion.

10. The integrated circuit of claim 1, further comprising a temperature sensor.

11. A packaging article comprising the integrated circuit of claim 1.

12. An electronic device comprising the integrated circuit of claim 1.