Base plate and semiconductor device

• US 8,896,113 B2
• Filed: 09/07/2012
• Issued: 11/25/2014
• Est. Priority Date: 09/21/2011
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Miyake, Eitaro
• Primary Examiner(s): Gumedzoe, Peniel M
• Application Number:
  US13/607,522
• Publication Number:
  US 20130069216A1
• Time in Patent Office: 809 Days
• Field of Search: 257/687, 257/712, 257/713, 257/E23.08, 257/E23.083, 257/E23.084, 257/E23.18
• US Class Current: 257/687
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2224/291 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/83385 Shape, e.g. interlocking features
• CPC Class Codes: H01L 23/02 Containers; Seals H01L23/12, H01L23/34, H01L23/48, H01L23/552, H01L23/66 take precedence; for memories G11C
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/0781 being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/3511 Warping
• CPC Class Codes: Y10T 428/24273 including aperture

Abstract

According to one embodiment, the base plate includes first and a second faces that are opposed to each other; the second face has a contoured rear surface, and the first area is set in the center of the plate. There is a second area with via holes in the peripheral areas of the center part. Also, the thickness of the second area is less than the thickness of the first area.

Claims

1. A base plate comprising:

a first area with a first face and a second face that are opposed to each other, in which the second face has a convex surface over a span of the entire second face, the first area provided in a center of the plate; and

a second area, having holes extending therethrough, at a periphery of the first area, wherein

a thickness of the second area is less than a thickness of the first area.

2. The base plate according to claim 1, wherein:

the base plate has a rectangular profile and corners,

the second area comprises a plurality of second area portions, each of which is provided at one of the corners, and

a continuous linear wall extends between each of the second area portions and the first area.

3. The base plate of claim 2, wherein the linear wall follows a straight line path.

4. The base plate of claim 2, wherein linear wall is curved.

5. The base plate of claim 1, wherein the second area is inset from the first face.

6. The base plate of claim 1, wherein the second area provides a stress relief region to reduce stress imposed in the first area when the contour of the base plate is changed.

7. The base plate of claim 1, wherein the first and the second areas are formed of the same material.

8. A base plate comprising:

a first area with a first face and a second face that are opposed to each other, in which the second face has a convex surface, the first area provided in the center of the plate; and

a second area, having holes extending therethrough, at a periphery of the first area, wherein

at least one aperture is formed through the second area, and

the second area is made of a first material and a second material surrounding the aperture, the second material having a hardness that is greater than that of the first material and the second area having a thickness that is less than that of the first area.

9. A mounting assembly comprising:

a base plate comprising;

a first area with a first face and a second face that are opposed to each other, in which the second face has a convex surface over a span of the entire second face and the first area is located in a central area of the plate;

a second area, provided with a hole therethrough, disposed at a periphery of the first area, wherein

a thickness of the second area is less than a thickness of the first area; and

a semiconductor device mounted to a first side of the first area of the base plate via a bonding agent.

10. The mounting assembly according to claim 9, further comprising:

a case overlying the semiconductor device and the base plate; and

a resin material disposed between the case and the semiconductor device.

11. The mounting assembly according to claim 10, wherein:

the second area includes a portion thereof which extends between the hole and the first portion;

a heat sink is secured to the base plate by at least one fastener extending through the hole in the second area, the second face of the base plate being positioned against the heat sink across a span of the first area; and

the portion of the second area has a deformed portion therein.

12. The mounting assembly according to claim 11, wherein the deformed portion is buckled.

13. The mounting assembly of claim 11, wherein the first area and second area are formed of a single material and a generally linear wall joins the first and the second areas.

14. The mounting assembly of claim 13, wherein the base plate is a stamping die.

15. The mounting assembly of claim 11, wherein the second area is made of a first material and a second material of a higher hardness than the first material, the second material surrounding the hole extending through the second area.