Piezoelectric MEMS microphone

• US 8,896,184 B2
• Filed: 08/09/2013
• Issued: 11/25/2014
• Est. Priority Date: 06/30/2008
• Status: Active Grant

• Current Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Original Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Inventors: Grosh, Karl, Littrell, Robert J.
• Primary Examiner(s): Rosenau, Derek
• Assistant Examiner(s): GORDON, BRYAN P
• Application Number:
  US13/963,661
• Publication Number:
  US 20130329920A1
• Time in Patent Office: 473 Days
• Field of Search: 310/338, 310/332, 310/367, 310/368, 381/114
• US Class Current: 310/332
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 3/0021 Transducers for transforming electrical into mechanical energy or vice versa dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00
• CPC Class Codes: B81C 1/0015 Cantilevers switches using MEMS H01H1/0036; electrostatic relays using micromechanics H01H59/0009; microelectro-mechanical resonators H03H9/02244
• CPC Class Codes: B81C 1/00158 Diaphragms, membranes manufacture process for semi-permeable inorganic membranes B01D67/0039
• CPC Class Codes: H04R 17/00 Piezoelectric transducers; Electrostrictive transducers piezoelectric or electrostrictive elements in general H10N30/00; details of piezoelectric or electrostrictive motors, generators or positioners H10N30/00
• CPC Class Codes: H04R 17/02 Microphones
• CPC Class Codes: H04R 17/10 Resonant transducers, i.e. adapted to produce maximum output at a predetermined frequency
• CPC Class Codes: H04R 2201/003 Mems transducers or their use
• CPC Class Codes: H10N 30/05 Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
• CPC Class Codes: H10N 30/302 Sensors
• CPC Class Codes: H10N 30/306 Cantilevers
• CPC Class Codes: H10N 30/50 having a stacked or multilayer structure

Abstract

A piezoelectric MEMS microphone comprising a multi-layer sensor that includes at least one piezoelectric layer between two electrode layers, with the sensor being dimensioned such that it provides a near maximized ratio of output energy to sensor area, as determined by an optimization parameter that accounts for input pressure, bandwidth, and characteristics of the piezoelectric and electrode materials. The sensor can be formed from single or stacked cantilevered beams separated from each other by a small gap, or can be a stress-relieved diaphragm that is formed by deposition onto a silicon substrate, with the diaphragm then being stress relieved by substantial detachment of the diaphragm from the substrate, and then followed by reattachment of the now stress relieved diaphragm.

Claims

1. A piezoelectric MEMS microphone, comprising:

a substrate; and

a multi-layer acoustic sensor comprising a plurality of cantilevered beams, each beam comprising a first electrode layer, a piezoelectric layer, and a second electrode layer, each beam extending between a fixed end supported by the substrate and a free end free from the substrate, wherein the free ends of at least two of the beams face one another and are separated by a gap.

2. A piezoelectric MEMS microphone of claim 1, wherein the multi-layer acoustic sensor has a thickness no greater than 8 μ

m.

3. A piezoelectric MEMS microphone of claim 1, wherein the first and second electrode layers and the piezoelectric layer together have a thickness no greater than 2 μ

m.

4. A piezoelectric MEMS microphone of claim 1, wherein the piezoelectric layer comprises a layer of piezoelectric material deposited directly onto a surface of the first electrode layer and the second electrode layer comprises a layer of electrode material deposited directly onto a surface of the piezoelectric material.

5. A piezoelectric MEMS microphone of claim 1, further comprising a transistor having a control input connected to the electrode layers such that signals received from the sensor on the control input are amplified by the transistor.

6. A piezoelectric MEMS microphone of claim 1, wherein the gap is no greater than 3 μ

m.

7. A piezoelectric MEMS microphone of claim 1, wherein adjacent beams are separated by a gap that is no greater than 10 μ

m.

8. A piezoelectric MEMS microphone of claim 1, wherein the plurality of beams include a plurality of stacked beam sets, each stacked beam set including at least five alternating layers of electrode material and piezoelectric material.

9. A piezoelectric MEMS microphone of claim 1, wherein the widths of the beams taper from the cantilevered end toward the free end, such that the width of each beam at the free end are narrower than the widths of the beams at the cantilevered end.

10. A piezoelectric MEMS microphone of claim 1, wherein the beams are covered with an insulating layer, whereby the microphone comprises a hydrophone.

11. A piezoelectric MEMS microphone, comprising:

a silicon substrate;

a first and a second cantilevered beam, each extending between a fixed end supported by the substrate and a free end free from the substrate, the first and second beams collinearly arranged along their respective longitudinal axes, the free ends of the first and second beams adjacent each other and separated by a gap, each beam comprising a deposited layer of electrode material and a deposited layer of piezoelectric material overlying the electrode material;

wherein at least some of the beams are stacked such that the stacked beams include alternative layers of deposited electrode material and deposited piezoelectric material with no additional layers therebetween.

12. A piezoelectric MEMS microphone of claim 11, wherein each of the layers of piezoelectric material has a thickness of no greater than 2 μ

m.