Lithographic apparatus and method

• US 8,896,808 B2
• Filed: 06/21/2006
• Issued: 11/25/2014
• Est. Priority Date: 06/21/2006
• Status: Expired due to Fees

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Tinnemans, Patricius Aloysius Jacobus
• Primary Examiner(s): Whitesell Gordon, Steven H
• Application Number:
  US11/471,727
• Publication Number:
  US 20070296942A1
• Time in Patent Office: 3,079 Days
• Field of Search: 355/53, 355/67, 359/851
• US Class Current: 355/53
• CPC Class Codes: G03F 7/70291 Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
• CPC Class Codes: G03F 7/70433 Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
• CPC Class Codes: G03F 7/705 Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
• CPC Class Codes: G03F 9/7026 Focusing

Abstract

A lithographic apparatus includes an illumination system, an array of individually controllable elements, a projection system, and a control system. The illumination system conditions a radiation beam. The array of individually controllable elements modulates the cross-section of the radiation beam. The projection system projects the modulated radiation beam onto a target portion of a substrate. The control system calculates a pattern that is to be formed on the array of individually controllable elements. The calculation includes an adjustment of the pattern, such that its focal plane is shifted in response to a measured separation between the target portion of the substrate and a focal plane of the projection system.

Claims

1. A lithographic apparatus, comprising:

an array of individually controllable elements configured to modulate a radiation beam;

a projection system configured to project the modulated radiation beam onto a target portion of a substrate;

a measuring system configured to measure a separation between an image plane of the projection system and the target portion of the substrate;

a memory coupled to the control system, the memory being configured to store pre-calculated adjusted patterns; and

a control system configured to determine a projected pattern to be formed by the array of individually controllable elements, the determination including selection of a pattern from the pre-calculated adjusted patterns stored in the memory, the selection based on the measured separation between the image plane of the projection system and the target portion of the substrate such that the image plane of the projected pattern is shifted by an amount so as to focus the projected pattern onto the target portion of the substrate in response to the measured separation between the target portion of the substrate and the image plane.

2. The lithographic apparatus of claim 1, wherein the control system is configured to determine the adjustment of the image plane of the projected pattern, at least in part, using a fractional Fourier transform.

3. The lithographic apparatus of claim 1, wherein the control system is configured to adjust the array to thereby shift the image plane of the projected pattern, such that the focal plane corresponds with the target portion of the substrate.

4. The lithographic apparatus of claim 1, wherein the control system is configured to adjust the array to thereby shift the image plane of the projected pattern to one of a plurality of predetermined alternative image planes.

5. The lithographic apparatus of claim 4, wherein the control system is configured to adjust the array to achieve at least two alternative image planes.

6. The lithographic apparatus of claim 5, wherein the control system is configured to adjust the array to achieve at least four alternative image planes.

7. The lithographic apparatus of claim 1, further comprising:

a plurality of the arrays of individually controllable elements.

8. The method of claim 1, wherein the adjusted pattern includes phase-shifted features.

9. A method of forming a device, comprising:

measuring a separation between a target portion of a substrate and an image plane of a projection system to generate a measured signal;

determining an adjustment to pattern data based on the measured signal, the determining including selection of a pattern from pre-calculated adjusted patterns based on the measured separation between the image plane of the projection system and the target portion of the substrate such that the image plane of the projected pattern is shifted in response to the measured separation between the target portion of the substrate and the image plane;

forming a pattern on a patterning device using the adjusted pattern data;

patterning a beam of radiation using the patterning device; and

projecting the patterned beam onto the target portion of the substrate.

10. The method of claim 9, wherein the determining is performed at least in part using a fractional Fourier transform.

11. The method of claim 9, wherein the determining comprises shifting the image plane, such that it corresponds with the target portion of the substrate.

12. The method of claim 9, wherein the determining comprises shifting the image plane to one of a plurality of predetermined alternative image planes.

13. The method of claim 12, wherein the determining comprises providing at least two alternative image planes.

14. The method of claim 13, wherein the determining comprises providing at least four alternative image planes.

15. The method of claim 12, wherein the determining further comprises storing a plurality of predetermined adjusted patterns.

16. The method of claim 9, further comprising adjusting a height of a substrate table holding the substrate such that the image plane of the projected pattern is aligned with a plane that is a calculated average height of an upper surface of the substrate.

17. The method of claim 9, further comprising tilting a substrate table holding the substrate to correct for a slope of an upper surface of the substrate.

18. A lithographic apparatus, comprising:

an array of individually controllable elements configured to pattern a radiation beam;

a projection system configured to project the patterned beam onto a target portion of a substrate;

a measuring system configured to measure a separation between an image plane of the projection system and the target portion of the substrate; and

a control system configured to determine a projected pattern to be formed by the array of individually controllable elements, the determining including selection of a pattern from a plurality of pre-calculated adjusted patterns, the selection based on the measured separation between the image plane of the projection system and the target portion of the substrate, wherein the selected pattern causes the image plane of the projected pattern to shift by an amount so as to focus the projected pattern onto the target portion of the substrate in response to the measured separation between the target portion of the substrate and the image plane.

19. The lithographic apparatus of claim 18, wherein the control system is configured to determine the adjustment of the image plane of the projected pattern, at least in part, using a fractional Fourier transform.