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Input device layers and nesting

  • US 8,896,993 B2
  • Filed: 05/14/2012
  • Issued: 11/25/2014
  • Est. Priority Date: 03/02/2012
  • Status: Active Grant
First Claim
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1. An input device comprising:

  • a sensor substrate having one or more conductors disposed on a first side of the sensor substrate and one or more surface mount hardware elements disposed on an second side of the sensor substrate that is opposite the first side;

    a flexible contact layer spaced apart from the sensor substrate and configured to flex in response to an application of pressure to contact the sensor substrate to initiate an input for a computing device that is communicatively coupled to the input device; and

    one or more layers disposed on the second side of the sensor substrate, the one or more layers having one or more openings therein such that at least a portion of the one or more surface mount hardware elements is disposed through the one or more openings thereby nesting the one or more surface mount hardware elements within the one or more layers.

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