Heat removal in compact computing systems

• US 8,897,016 B2
• Filed: 10/02/2012
• Issued: 11/25/2014
• Est. Priority Date: 11/17/2009
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Degner, Brett W., Augenbergs, Peteris K., Liang, Frank, Heresztyn, Amaury J., Mathew, Dinesh, Wilson, Thomas W.
• Primary Examiner(s): Thomas, Bradley
• Application Number:
  US13/633,823
• Publication Number:
  US 20130094141A1
• Time in Patent Office: 784 Days
• Field of Search: 361717-720, 361/702, 361/704, 361/709, 361/711, 36167952-67954, 165/104.33, 165/80.2, 174/15.2, 257/706, 257/675, 257/713
• US Class Current: 361/719
• CPC Class Codes: B23P 15/26 heat exchangers or the like making heat exchangers by methods covered by other subclasses B21D53/02
• CPC Class Codes: F28F 1/00 Tubular elements; Assemblies of tubular elements specially adapted for movement F28F5/00
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00
• CPC Class Codes: Y10T 29/49353 Heat pipe device making

Abstract

A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.

Claims

1. A low profile heat removal assembly, comprising:

an integrated circuit coupled with a surface of a printed circuit board (PCB), the integrated circuit extending a first distance from the surface of the PCB;

a slug that conducts heat from the integrated circuit to a heat pipe in thermal contact with a heat sink; and

a stage mechanically coupled with the PCB and configured to apply a force to the integrated circuit by way of the slug,

wherein at least a portion of the heat pipe is disposed within a region bound laterally by a periphery of the slug, wherein the region begins at the surface of the PCB and extends the first distance away from the surface of the PCB, and wherein the heat pipe is displaced laterally to one side of the integrated circuit.

2. The low profile heat removal assembly as recited in claim 1, wherein the stage further comprises a plurality of openings, each opening configured to accept a fastener that couples the stage to the PCB.

3. The low profile heat removal assembly as recited in claim 2, wherein the heat pipe is integrally formed with the slug.

4. The low profile heat removal assembly as recited in claim 2, wherein the heat pipe is homogenously formed with the slug.

5. The low profile heat removal assembly as recited in claim 2, wherein the heat pipe is homogenously formed with both the slug and the stage.

6. The low profile heat removal assembly as recited in claim 2, wherein the stage is mechanically coupled directly to the slug.

7. The low profile heat removal assembly as recited in claim 6, wherein each of the plurality of fasteners is a shoulder screw configured to interact with both a boss disposed on the PCB and a spring to exert a predefined amount of force on the stage.

8. The low profile heat removal assembly as recited in claim 1, wherein a top surface of the slug is substantially flush with a top surface of the stage.

9. A method for removing heat generated by an electrical component, the electrical component mounted to a substrate, the substrate mounted to a surface of a printed circuit board (PCB), the method comprising:

providing a slug in direct thermal contact with the electrical component;

providing a heat pipe that receives heat from the electrical component by way of the slug; and

applying a force to the electrical component through the slug by a stage, the stage comprising a fastener opening configured to accept a fastener that mechanically couples the stage to a surface of the PCB,

wherein at least a portion of the heat pipe is disposed within a region bound laterally by a periphery of the slug, wherein the region extends from the surface of the PCB to a height above the PCB no greater than a distance that the electrical component extends from the surface of the PCB and wherein the heat pipe is laterally displaced to one side of the electrical component.

10. The method as recited in claim 9, further comprising:

using a heat exchanging medium carried by the heat pipe to transfer heat generated by the electrical component to an external heat sink in thermal contact with the heat pipe.

11. The method as recited in claim 10, wherein providing a slug in direct thermal contact with the electrical component comprises exerting force directly on at least one winglet portion of the slug such that a predefined amount of pressure is applied to the electrical component by way of the slug.

12. The method as recited in claim 11, wherein the fastener is a spring-loaded shoulder screw that provides the predefined amount of pressure to the electrical component, and wherein the electrical component is an integrated circuit.

13. An electronic device, comprising:

a printed circuit board (PCB);

an electrical component coupled with a surface of the PCB, the electrical component extending a first distance from the surface of the PCB;

a heat pipe configured to transfer heat generated by the electrical component to a heat sink in thermal contact with the heat pipe;

a slug that conducts the heat generated by the electrical component to the heat pipe;

a stage comprising a slug attachment feature configured to couple the stage to the slug; and

a plurality of fasteners securing the stage to the surface of the PCB,

wherein at least a portion of the heat pipe is disposed within a region bound laterally by a periphery of the slug, wherein the region begins at the surface of the PCB and extends the first distance away from the surface of the PCB, and wherein the heat pipe is displaced laterally to one side of the electrical component.

14. The electronic device as recited in claim 13, further comprising:

a substrate configured to couple the electrical component with the PCB; and

a plurality of bosses disposed proximate to the substrate and providing mounting points for the plurality of fasteners to be secured to the PCB.

15. The electronic device as recited in claim 14, wherein the electrical component and the heat pipe are about the same distance away from the surface of the PCB.

16. The electronic device as recited in claim 15, wherein a top surface of the slug is substantially flush with a top surface of the stage.

17. The electronic device as recited in claim 16, wherein the heat pipe is homogenously formed with the slug.

18. The electronic device as recited in claim 17, wherein the electronic device is a portable computer.

19. The electronic device as recited in claim 18, wherein the electrical component comprises an integrated circuit.

20. The electronic device as recited in claim 13, wherein the heat pipe is laterally displaced to one side or the other of the electrical component.