Apparatus for depositing a multilayer coating on discrete sheets

• US 8,900,366 B2
• Filed: 04/22/2005
• Issued: 12/02/2014
• Est. Priority Date: 04/15/2002
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Rosenblum, Martin Philip, Chu, Xi, Moro, Lorenza, Nelson, Kenneth Jeffrey, Burrows, Paul, Gross, Mark E., Zumhoff, Mac R., Martin, Peter M., Bonham, Charles C., Graff, Gordon L.
• Primary Examiner(s): MOORE, KARLA A
• Application Number:
  US11/112,880
• Publication Number:
  US 20050239294A1
• Time in Patent Office: 3,511 Days
• Field of Search: 118/719, 118724-726
• US Class Current: 118/719
• CPC Class Codes: B05D 1/60 Deposition of organic layers from vapour phase vapour phase deposition in general C23C14/00, C23C16/00
• CPC Class Codes: B05D 3/067 Curing or cross-linking the coating
• CPC Class Codes: B05D 7/52 Two layers
• CPC Class Codes: C23C 14/568 Transferring the substrates through a series of coating stations C23C14/562 takes precedence
• CPC Class Codes: H01L 21/67155 Apparatus for manufacturing or treating in a plurality of work-stations
• CPC Class Codes: H01L 21/67207 comprising a chamber adapted to a particular process
• CPC Class Codes: H01L 21/67236 the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
• CPC Class Codes: H10K 2102/311 Flexible OLED
• CPC Class Codes: H10K 50/84 Passivation; Containers; Encapsulations
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/164 using vacuum deposition

Abstract

A tool for depositing multilayer coatings onto a substrate. In one configuration, the tool includes a includes an in-line organic material deposition station operating under at least one of a pressure or temperature controlled environment. In another, it further is of a hybrid design that incorporates both in-line and cluster tool features. In this latter configuration, at least one of the deposition stations is configured to deposit an inorganic layer, while at least one other deposition station is configured to deposit an organic layer. The tool is particularly well-suited to depositing multilayer coatings onto discrete substrates, as well as to encapsulating environmentally-sensitive devices placed on the flexible substrate.

Claims

1. A device for depositing a stacked multilayer coating comprising a plurality of organic layers and a plurality of inorganic layers onto to an organic light-emitting diode that is placed onto a discrete, flexible substrate, said device comprising:

an inorganic layer deposition station defining a cluster configuration; and

a thermally-controlled organic layer deposition station defining an in-line configuration operatively coupled to said inorganic layer deposition station, said organic layer deposition station comprising;

an organic material supply;

an organic material evaporator;

an organic material deposition nozzle;

an organic material curing station; and

an organic material confinement mechanism comprising a reduced-pressure source placed in vacuum communication with at least said substrate such that during at least a portion of deposition of said organic layer onto said substrate, said organic material confinement mechanism operates to substantially prevent stray organic material that is about said substrate from reaching said organic material curing station, wherein said inorganic layer deposition station and said organic layer deposition station cooperate with one another to deposit said plurality of organic layers and said plurality of inorganic layers in an alternating pattern to encapsulate said organic light-emitting diode that is situated on said substrate.

2. The device of claim 1, wherein said thermal control of said organic layer deposition station comprises a cooling device for reducing the temperature of said substrate during deposition of at least one of said plurality of organic layers and said plurality of inorganic layers thereon.

3. The device of claim 2, wherein said organic layer deposition station further comprises a substrate-transport configured to convey said substrate between at least said organic material deposition nozzle and said organic layer curing station.

4. The device of claim 3, wherein said organic layer deposition station defines an isolatable interior chamber.

5. The device of claim 4, wherein said isolatable interior chamber defines a first region comprising said organic material confinement mechanism, and a second region selectively isolatable from said first region through a moveable shutter.

6. The device of claim 5, wherein said cooling device is in thermal communication with said second region, said cooling device configured to reduce the effect of a thermal load generated in said first region on said second region.

7. The device of claim 6, wherein said cooling device further comprises at least one cold trap disposed in thermal communication with said isolatable interior chamber.

8. The device of claim 5, further comprising at least one pump fluidly coupled to at least one of said first and second regions, said at least one pump configured to provide a localized vacuum in at least one of said first or second region of said organic material confinement mechanism.

9. The device of claim 8, wherein said at least one pump comprises a turbomolecular pump.

10. The device of claim 1, wherein said inorganic layer deposition station is configured to deposit a first layer of said stacked multilayer coating onto said substrate.

11. The device of claim 1, wherein said reduced-pressure source is placed in vacuum communication with said inorganic layer deposition station such that during at least a portion of deposition of said inorganic layer onto said substrate, said reduced-pressure source operates to create an at least partially evacuated environment about said substrate.

12. The device of claim 1, wherein said organic layer deposition station is further configured to deposit at least one inorganic layer onto said substrate.

13. The device of claim 12, wherein the part of said organic layer deposition station that is further configured to deposit at least one inorganic layer onto said substrate and the part of said organic layer deposition tool that is configured to deposit at least one organic layer onto said substrate cooperate with one another to deposit said multilayer coating onto said substrate.

14. The device of claim 1, wherein said reduced-pressure source comprises a pumping port that is vacuum connected to at least one of a vacuum source and a pumping assembly.

15. The device of claim 14, wherein said organic material confinement mechanism is cooperative with said pumping port and comprises an organic material thermal barrier and a shutter.

16. The device of claim 15, wherein said organic material confinement mechanism comprises a chamber within a chamber.

17. A tool for depositing a multilayer coating on a discrete substrate, said tool comprising:

a plurality of peripheral stations disposed about a substantially central hub and coupled thereto such that said substantially central hub can transport said substrate between at least one of said peripheral stations, said plurality of peripheral stations comprising;

an inorganic barrier layer forming station comprising a cluster configuration; and

at least one organic layer forming station comprising an in-line configuration with an organic material supply, an organic material evaporator, an organic material deposition nozzle, an organic material curing station and a vacuum-based organic material confinement mechanism such that during at least a portion of deposition of said organic layer onto said substrate, said organic material confinement mechanism operates to substantially prevent stray organic material that is about said substrate from reaching said organic material curing station, wherein said inorganic layer forming station and said organic layer forming station cooperate with one another to deposit said multilayer coating that comprises an alternating pattern of organic layers and inorganic layers to encapsulate an organic light-emitting diode that is situated on said substrate;

a reduced-pressure source placed in vacuum communication with at least one of said inorganic barrier layer forming station and said organic layer forming station such that during at least a portion of deposition of said multilayer coating onto said substrate, said reduced-pressure source operates to create an at least partially evacuated environment about said substrate; and

a temperature control device placed in thermal communication with at least said organic layer forming station such that during at least a portion of deposition of said multilayer coating onto said substrate, said temperature control device operates to adjust the temperature of said substrate.

18. The tool of claim 17, wherein said temperature control device is configured to reduce the temperature of said substrate.

19. The tool of claim 17, further comprising at least one masking station disposed in said tool, said masking station configured to place at least one mask on said substrate.

20. The tool of claim 17, wherein said at least one organic layer forming station comprises a substrate-transport configured to convey said substrate between at least said organic material deposition nozzle and said organic material curing station.

21. The tool of claim 17, wherein said at least one organic layer forming station is further configured to deposit at least one inorganic layer onto said substrate.

22. The tool of claim 21, wherein the part of said at least one organic layer forming station that is further configured to deposit at least one inorganic layer onto said substrate and the part of said at least one organic layer forming station that is configured to deposit at least one organic layer on said substrate cooperate with one another to deposit said multilayer coating onto said substrate.

23. A tool for depositing a multilayer coating that comprises an alternating pattern of organic layers and inorganic layers to encapsulate an organic light-emitting diode that is situated on a discrete substrate, said tool comprising:

a monomer layer deposition station comprising an in-line tool to deposit at least one organic layer onto said substrate, said in-line tool comprising an organic material supply, an organic material evaporator, an organic material deposition nozzle, an organic material curing station and a vacuum-based organic material confinement mechanism;

an inorganic barrier layer deposition station cooperative with said monomer layer deposition station, said barrier layer deposition station comprising a cluster tool to deposit at least one inorganic layer onto said substrate; and

a reduced-pressure source placed in vacuum communication with said at least said organic material confinement mechanism such that during at least a portion of deposition of said multilayer coating onto said discrete substrate, said reduced-pressure source operates to create an at least partially evacuated environment about said substrate, with said organic material confinement mechanism operative to substantially prevent stray organic material that is about said substrate from reaching said organic material curing station during said encapsulation of said organic light-emitting diode between substrate and said multilayer coating.

24. The tool of claim 23, further comprising a masking station cooperative with said tool, said masking station configured to place at least one mask on said substrate.

25. The tool of claim 24, wherein said masking station comprises an organic mask placement device and an inorganic mask placement device.

26. The tool of claim 23, wherein said monomer layer deposition station and said barrier layer deposition station are configured to reverse said substrate along respective transport paths therein such that multiple layers of said multilayer coating may be deposited.

27. The tool of claim 23, further comprising an environmental isolation valve disposed between said monomer layer deposition station and said barrier layer deposition station.

28. The tool of claim 23, further comprising at least one surface treatment chamber configured to enhance the ability of individual layers of said multilayer coating to adhere to said substrate or an adjacent layer of said multilayer coating.

29. The tool of claim 28, wherein said surface treatment chamber is disposed in said monomer layer deposition station.

30. The tool of claim 29, wherein said surface treatment chamber comprises a plasma energy source.

31. The tool of claim 29, wherein said surface treatment chamber comprises a thermal evaporation device.

32. The tool of claim 29, wherein said thermal evaporation device is configured to deposit a non-oxide material.

33. The tool of claim 32, wherein said non-oxide material comprises at least one of lithium fluoride or magnesium fluoride.

34. The tool of claim 23, wherein said barrier layer deposition station is configured to place an inorganic layer onto said substrate prior to the placement of an organic layer from said monomer layer deposition station.

35. The tool of claim 23, wherein said reduced-pressure source is configured to provide a different vacuum level during deposition of said inorganic layer than during deposition of said organic layer.

36. The tool of claim 23, wherein said monomer layer deposition station configured as an in-line tool is further configured to deposit at least one inorganic layer onto said substrate.

37. The tool of claim 36, wherein the part of said monomer layer deposition station configured as an in-line tool that is further configured to deposit at least one inorganic layer on said substrate and the part of said monomer layer deposition station configured as an in-line tool that is configured to deposit at least one organic layer on said substrate cooperate with one another to deposit a multilayer coating onto said substrate.

38. An encapsulating tool configured to deposit a multilayer coating onto an organic light emitting diode placed on a discrete substrate, said encapsulating tool comprising:

an inorganic layer deposition tool comprising a cluster configuration, said inorganic layer deposition tool configured to deposit at least one inorganic layer onto said organic light emitting diode;

an organic layer deposition tool comprising an in-line configuration with an organic material supply, an organic material evaporator, an organic material deposition nozzle, an organic material curing station and a vacuum-based organic material confinement mechanism, said organic layer deposition tool operatively coupled to said inorganic layer deposition tool and configured to deposit at least one organic layer onto said organic light emitting diode; and

a vacuum source coupled to at least said organic layer deposition tool such that during at least a portion of deposition of said organic layer onto said organic light emitting diode, said vacuum source operates to create an at least partially evacuated environment about said organic light emitting diode to substantially prevent stray organic material that is about said substrate from reaching said organic material curing station during said encapsulation of said organic light-emitting diode between substrate and said multilayer coating.

39. The encapsulation tool of claim 38, wherein said encapsulation tool is configured such that either said inorganic or organic layer can be first applied to said organic light emitting diode.

40. The encapsulation tool of claim 38, wherein said organic layer deposition tool is further configured to deposit at least one inorganic layer onto said substrate.

41. The encapsulation tool of claim 40, wherein the part of said organic layer deposition tool that is further configured to deposit at least one inorganic layer onto said substrate and the part of said organic layer deposition tool that is configured to deposit at least one organic layer onto said substrate cooperate with one another to deposit a multilayer coating onto said substrate.

42. A hybrid tool for encapsulating an organic light-emitting diode, said tool comprising:

an encapsulation device comprising;

an in-line organic layer forming station comprising;

an organic material deposition station comprising an organic material supply, an organic material evaporator and an organic material deposition nozzle;

an organic material curing station cooperative with said organic material deposition station;

a substrate-transport configured to convey a substrate between at least said organic material deposition station and said organic material curing station;

a vacuum-based organic material confinement mechanism comprising a reduced-pressure source placed in vacuum communication with said organic material deposition station such that during at least a portion of deposition of an organic layer onto a discrete substrate, said reduced-pressure source operates to create an at least partially evacuated environment about said substrate to substantially prevent stray organic material that is about said substrate from reaching said organic material curing station during encapsulation of said organic light-emitting diode between substrate and a multilayer coating comprising an alternating arrangement of organic and inorganic layers; and

a thermal control mechanism cooperative with at least one of said organic material deposition station and organic material curing station such that a temperature therein can be controlled during formation of said organic material on said substrate; and

a cluster-based barrier layer forming station configured to place at least one inorganic layer or said organic layer onto or over said substrate, said barrier layer forming station and said organic layer forming station cooperative with one another such that upon operation thereof said multilayer coating that comprises an alternating arrangement of said organic and barrier layers cooperates with said substrate to form said organic light-emitting diode into said encapsulated member;

a load lock to facilitate selective vacuum isolation between said encapsulation device and a remainder of said tool; and

an exchange mechanism to facilitate transport of said at least one encapsulated member between said encapsulation device and said remainder of said tool.

43. The tool of claim 42, wherein said exchange mechanism comprises an accumulator.

44. The tool of claim 42, wherein said organic layer forming station further comprises a cleaning system.

45. The tool of claim 44, wherein said cleaning system comprises a glow discharge device.

46. The tool of claim 42, wherein said organic layer forming station is further configured to deposit said at least one inorganic layer onto said substrate.

47. The tool of claim 46, wherein the part of said organic layer forming station that is further configured to deposit at least one inorganic layer onto said substrate and the part of said organic layer forming station that is configured to deposit at least one organic layer on said substrate cooperate with one another to deposit said multilayer coating onto said substrate.