Method of forming an overmolded dual in-line memory module cooling structure
First Claim
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1. A method of forming an overmolded dual in-line memory module (DIMM) cooling structure, the method comprising:
- providing, by a molding system, a mold for a DIMM, the DIMM including a portion with attached memory chips; and
forming, by the molding system, a thermal interface that includes thermal material, the thermal material surrounding at least the portion of the DIMM with the attached memory chips, the thermal interface to transfer heat from the DIMM to a cooling manifold, wherein the cooling manifold is a liquid pipe.
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Abstract
Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.
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Citations
9 Claims
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1. A method of forming an overmolded dual in-line memory module (DIMM) cooling structure, the method comprising:
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providing, by a molding system, a mold for a DIMM, the DIMM including a portion with attached memory chips; and forming, by the molding system, a thermal interface that includes thermal material, the thermal material surrounding at least the portion of the DIMM with the attached memory chips, the thermal interface to transfer heat from the DIMM to a cooling manifold, wherein the cooling manifold is a liquid pipe. - View Dependent Claims (2, 3, 4)
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5. A method of forming an overmolded dual in-line memory module (DIMM) cooling structure, the method comprising:
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forming, by the molding system, a thermal interface to contact and surround at least a portion of a DIMM having memory chips attached; the thermal interface to couple with a cooling manifold that includes a liquid cooled pipe, the thermal interface including thermal material to transfer heat from the DIMM to the cooling manifold. - View Dependent Claims (6, 7, 8, 9)
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Specification