Semiconductor device and programming method
First Claim
1. A method for fabricating a semiconductor device comprising:
- mounting a semiconductor chip on a chip mounting portion;
disposing a sheet-shaped resin in contact with the semiconductor chip;
coupling a wire between the semiconductor chip and the chip mounting portion, wherein the wire is partially embedded in the sheet-shaped resin; and
forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip.
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Accused Products
Abstract
The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.
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Citations
20 Claims
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1. A method for fabricating a semiconductor device comprising:
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mounting a semiconductor chip on a chip mounting portion; disposing a sheet-shaped resin in contact with the semiconductor chip; coupling a wire between the semiconductor chip and the chip mounting portion, wherein the wire is partially embedded in the sheet-shaped resin; and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A system comprising:
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means for mounting a semiconductor chip on a chip mounting portion; means for disposing the sheet-shaped resin comprises disposing the sheet-shaped resin in contact with the semiconductor chip; means for coupling a wire between the semiconductor chip and the chip mounting portion, wherein the wire is partially embedded in the sheet-shaped resin; means for forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A method for fabricating a semiconductor device comprising:
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mounting a semiconductor chip on an upper die portion; disposing a sheet-shaped resin on a lower die portion, wherein the sheet-shaped resin is disposed in contact with the semiconductor chip; coupling a wire between the semiconductor chip and the chip mounting portion, wherein the wire is partially embedded in the sheet-shaped resin; assembling the upper die portion and the lower die portion; and sealing the semiconductor chip with a sealing resin, wherein the sealing resin forms a resin sealing portion between the sheet-shaped resin and the upper die portion, to seal the semiconductor chip. - View Dependent Claims (18, 19, 20)
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Specification