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Alignment for backside illumination sensor

  • US 8,900,966 B2
  • Filed: 10/02/2013
  • Issued: 12/02/2014
  • Est. Priority Date: 12/06/2007
  • Status: Active Grant
First Claim
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1. A method comprising:

  • providing a substrate having a first region and second region, wherein the first region includes an integrated circuit;

    forming a recess in the second region of the substrate;

    forming a material within the recess in the second region of the substrate;

    forming another material within the recess, the another material being different than the material within the recess; and

    removing a portion of the substrate to expose a portion of the material, wherein the exposed material is an alignment mark.

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