Mitigation of block bending in a ring laser gyroscope caused by thermal expansion or compression of a circuit board
First Claim
Patent Images
1. An apparatus comprising:
- a sheet of circuit board material;
at least one electrically conductive trace positioned on the sheet of circuit board material;
at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace;
a first connection point configured to connect the sheet of circuit board material to an object resisting expansion or compression;
a second connection point configured to connect the sheet of circuit board material to the object resisting expansion or compression; and
at least one deformation point positioned between the first connection point and the second connection point and configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to the object resisting expansion or compression at the first connection point and the second connection point, wherein the absorption of stresses developed in the sheet of circuit board material minimizes the transfer of the stresses to the object resisting expansion or compression.
1 Assignment
0 Petitions
Accused Products
Abstract
An apparatus includes a sheet of circuit board material, at least one electrically conductive trace positioned on the sheet of circuit board material, and at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace. The apparatus further includes at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression.
55 Citations
20 Claims
-
1. An apparatus comprising:
-
a sheet of circuit board material; at least one electrically conductive trace positioned on the sheet of circuit board material; at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace; a first connection point configured to connect the sheet of circuit board material to an object resisting expansion or compression; a second connection point configured to connect the sheet of circuit board material to the object resisting expansion or compression; and at least one deformation point positioned between the first connection point and the second connection point and configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to the object resisting expansion or compression at the first connection point and the second connection point, wherein the absorption of stresses developed in the sheet of circuit board material minimizes the transfer of the stresses to the object resisting expansion or compression. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. An apparatus comprising:
-
an object resisting expansion or compression, the object having a top surface and a first coefficient of thermal expansion; a circuit board having a bottom surface and a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion of the object; a first connection point configured to connect the sheet of circuit board material to the object resisting expansion or compression; a second connection point configured to connect the sheet of circuit board material to the object resisting expansion or compression; and adhesive material bonding the bottom surface of the circuit board to the top surface of the object at the first connection point and the second connection point, wherein the adhesive material is configured to inhibit the transfer of stresses generated in the circuit board when the circuit board experiences resistance to expansion or compression caused by connection to the object resisting expansion or compression. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
-
-
17. A method comprising:
-
fabricating a sheet of circuit board material with at least one deformation point between a first section and a second section of the sheet of circuit board material, the first section of the sheet of circuit board material having a first connection point and the second section of the sheet of circuit board material having a second connection point; fabricating at least one electrically conductive trace on the sheet of circuit board material; fabricating at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace; and wherein the at least one deformation point absorbs stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression at the first connection point and the second connection point, wherein the absorption of stresses developed in the sheet of circuit board material minimizes the transfer of the stresses to the object resisting expansion or compression. - View Dependent Claims (18)
-
-
19. An apparatus comprising:
-
a circuit board having a bottom surface and at least one deformation point between a first section and a second section of the sheet of circuit board, the first section of the circuit board having a first connection point and the second section of the circuit board having a second connection point; an object having a top surface; adhesive material attaching the bottom surface of the circuit board to the top surface of the object; wherein the at least one deformation point absorbs stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression at the first connection point and the second connection point, wherein the absorption of stresses developed in the circuit board minimizes the transfer of the stresses to the object resisting expansion or compression; and wherein the adhesive material inhibits transfer of stresses from the circuit board to the object. - View Dependent Claims (20)
-
Specification